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git://projects.qi-hardware.com/ben-wpan.git
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39 lines
1.2 KiB
Plaintext
39 lines
1.2 KiB
Plaintext
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Board characteristics:
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- stacking: 2 layers, solder mask on front and back, silk screen on front
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- board material: FR4, thickness 0.8 mm, 1 oz copper
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- surface finish: TBD, both ENIG and tin are acceptable
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- via holes: diameter is nominally 10 mil, but any size <= 15 mil can be used
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- mechanical tolerances: <= +/- 0.1 mm on all sides
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Layer stacking, from top to bottom:
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atusb-SilkS_Front.gto Front silk screen
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atusb-Mask_Front.gts Front solder mask
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atusb-Front.gtl Front copper
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atusb-Back.gbl Back copper
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atusb-Mask_Back.gbs Back solder mask (empty)
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Other design files:
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atusb-PCB_Edges.gbr Board edges, for routing (Gerber)
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atusb.dxf idem (AutoCAD DXF)
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atusb.drl Excellon drill file
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Interpretation of files:
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- do not print PCB edges on front/back copper
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- do not print component values on silk screen
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- the center (!) of the board edge line marks the true board edge, e.g.,
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Edge line (5 mil)
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=======
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------- - - - - - ----------
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PCB outside | | PCB inside
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------- - - - - - ----------
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Volume removed when cutting
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(width depends on tool used)
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