2010-08-09 07:17:33 +03:00
|
|
|
#
|
|
|
|
|
# Tags:
|
|
|
|
|
#
|
|
|
|
|
# F Footprint name (must be first)
|
2010-08-10 18:26:24 +03:00
|
|
|
# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
|
2010-08-09 07:17:33 +03:00
|
|
|
#
|
|
|
|
|
|
|
|
|
|
# TI meandered inverted F antenna
|
|
|
|
|
F: meander
|
2010-08-10 18:26:24 +03:00
|
|
|
N: AN043
|
2010-08-09 21:48:06 +03:00
|
|
|
|
|
|
|
|
# Mini-USB B receptable (SMT; almost generic)
|
|
|
|
|
F: mini_usb_b
|
|
|
|
|
|
|
|
|
|
# Standard rectangular passive components
|
|
|
|
|
F: stdpass
|
2010-08-12 15:39:13 +03:00
|
|
|
|
|
|
|
|
# "Generic" simple QFN
|
|
|
|
|
F: qfn
|
|
|
|
|
#
|
|
|
|
|
# The information for these packages comes from various sources:
|
|
|
|
|
#
|
|
|
|
|
# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
|
|
|
|
|
# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
|
|
|
|
|
# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
|
|
|
|
|
# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
|
|
|
|
|
# http://www.nxp.com/package/SOT617-1.html
|
|
|
|
|
# http://www.nxp.com/package/SOT617-3.html
|
|
|
|
|
#
|
|
|
|
|
# Known bugs:
|
|
|
|
|
#
|
|
|
|
|
# - we should distribute the solder paste in an array of small
|
|
|
|
|
# squares instead of just covering the whole center pad.
|
|
|
|
|
# - really ought to merge all the various QFN definitions (we have more
|
|
|
|
|
# over at gta02-core) into a single QFN file with a big mean table of
|
|
|
|
|
# everything
|
|
|
|
|
#
|
|
|
|
|
N: sot617-3-lp
|
2010-08-12 16:33:59 +03:00
|
|
|
|
|
|
|
|
# Common 4-pin crystal SMT package (pins 1 and 4 are on a short side, pin
|
|
|
|
|
# numbering is counter-clockwise)
|
|
|
|
|
F: xtal-4
|
|
|
|
|
N: nx3225sa
|
2010-08-12 21:28:03 +03:00
|
|
|
|
|
|
|
|
# Solder pads and test points
|
|
|
|
|
F: pads
|
