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increased solder paste deposits in QFN32-VHHD-2 and QFN32-VHHD-6

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Note that QFN28-Atmel and QFN28-SiLabs still need verifying.
QFN28-SiLabs is quite differnt from NXP's specification.

- modules/INFO: added description of solder paste deposit dimensioning
  rules (based on NXP's AN10365)
- modules/qfn.fpd (QFN32-VHHD-2, QFN32-VHHD-6): increased solder paste
  deposits according to the rules
This commit is contained in:
Werner Almesberger
2011-03-22 12:26:46 -03:00
parent 7cf2b0d352
commit 3a80f068ba
2 changed files with 27 additions and 4 deletions
Download Patch File Download Diff File Expand all files Collapse all files

4
modules/qfn.fpd
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@@ -105,8 +105,8 @@ table
{ pins, variant, X1, Y1, X2, Y2, E, C1, C2, SE, SNX, SNY, SX, SY }
{ 28, "Atmel", 0.24mm, 0.7mm, 2.4mm, 2.4mm, 0.45mm, 4.1mm, 4.1mm, 1mm, 2, 2, 0.8mm, 0.8mm }
{ 28, "SiLabs", 0.25mm, 0.9mm, 3.3mm, 3.3mm, 0.5mm, 4.8mm, 4.8mm, 1.1mm, 3, 3, 0.9mm, 0.9mm }
{ 32, "VHHD-2", 0.26mm, 0.69mm, 3.7mm, 3.7mm, 0.5mm, 5.1mm, 5.1mm, 0.8mm, 3, 3, 0.5mm, 0.5mm }
{ 32, "VHHD-6", 0.26mm, 0.69mm, 3.4mm, 3.4mm, 0.5mm, 5.1mm, 5.1mm, 1.2mm, 2, 2, 0.7mm, 0.7mm }
{ 32, "VHHD-2", 0.26mm, 0.69mm, 3.7mm, 3.7mm, 0.5mm, 5.1mm, 5.1mm, 0.8mm, 3, 3, 0.55mm, 0.55mm }
{ 32, "VHHD-6", 0.26mm, 0.69mm, 3.4mm, 3.4mm, 0.5mm, 5.1mm, 5.1mm, 1.2mm, 2, 2, 0.75mm, 0.75mm }
set w = 5mil