1
0
mirror of git://projects.qi-hardware.com/ben-wpan.git synced 2024-11-23 00:14:59 +02:00
Commit Graph

5 Commits

Author SHA1 Message Date
Werner Almesberger
3a80f068ba increased solder paste deposits in QFN32-VHHD-2 and QFN32-VHHD-6
Note that QFN28-Atmel and QFN28-SiLabs still need verifying.
QFN28-SiLabs is quite differnt from NXP's specification.

- modules/INFO: added description of solder paste deposit dimensioning
  rules (based on NXP's AN10365)
- modules/qfn.fpd (QFN32-VHHD-2, QFN32-VHHD-6): increased solder paste
  deposits according to the rules
2011-03-22 12:37:16 -03:00
Werner Almesberger
5a9ec34420 qfn.fpd: added draft for Atmel VQFN28 (ATmega48) 2011-01-31 18:53:21 -03:00
Werner Almesberger
3a59aef242 qfn.fpd: corrected center pads, and general cleanup
- qfn.fpd: package names now also include the variant (for now: SiLabs,
  VHHD-2, or VHHD-6)
- qfn.fpd: inlarged center pad of QFN28-SiLabs (was QFN28) from 3.25 mm
  to 3.3 mm
- qfn.fpd: reverted QFN32-VHHD6 (was QFN32) to original geomtry
- qfn.fpd: introduced QFN32-VHHD2 for the ATmega32U2
- qfn.fpd: distribute solder paste in little islands (in progress)
- qfn.fpd: deleted stray unused vector in root frame
2011-01-23 01:15:18 -03:00
Werner Almesberger
8703fc1a0b qfn.fpd: added measurements and improved design of the central pad
- qfn.fpd: where were no measurements at all - added them
- qfn.fpd: parametrize 0.1 mm border between central pad and land pattern
  and increase it from 0.1 mm to 5 mil (recommended by Adam Wang)
- qfn.fpd: define solder paste of central pad separately and give it a 5
  mil border to the pad edge, 10 mil to the copper edge (parameters
  recommended by Adam Wang)
2011-01-21 21:59:34 -03:00
Werner Almesberger
87588bed0e Added QFN28 and QFN32 footprints for MCU and TXRX. 2010-08-12 09:39:13 -03:00