- atben/atben.brd, atusb/atusb.brd: set solder mask clearance of fiducials
to 0.1 mil, so that the real solder mask opening has a diameter of
almost) exactly 2 mm (instead of 2 mm plus 10 mil)
- atusb.pro: added fiducial.mod
- atusb.brd: added two fiducial marks
- atusb.brd: adjusted RF and RF power ground zones
- atusb.brd (CON1): moved component reference out of the way
- atusb.brd: bumped version to 110323
- atusb.brd (C22): properly aligned reference with component center
- atusb.brd (P11, P12, P13, P14): moved reference below the pad, for
consistency with P15 and P16
- atusb.brd (CON1): centered the component reference
- atusb.brd: enabled Drawings layer
- atusb.brd: moved board dimensions to Drawings layer
- Makefile (clean): added $(NAME)-Drawings.gbr
- Makefile (GMERGE, gerber): use "gmerge" to merge Comments (which now
only contains the component references) into SilkS_Front
- Makefile (gerbv): Comments is now redundant; removed it
- Makefile (VERSION): bumped version from 110314 to 110314
- atusb.brd: bumped version on copper and re-generated version on silk
screen
- atusb.brd: bumped version in board meta-data
- atusb/Makefile (gerber, fab): use pcbnew with --origin=aux for Gerber,
drill, and DXF
- atusb/atusb.brd: set auxiliary origin to lower left corner of board
- Makefile (cptx): new target to update the version number on the silk
screen
- atusb.brd: duplicated the version number from the back copper on the
front silk screen
- atusb.brd: moved author tag to make room for front version number
- atben.brd (B1), atusb.brd (B1): marked pin 1 location with a circle
- atusb.brd (D1): marked anode with a plus sign and moved the component
reference
- atusb.brd: updated for schematics changes
- atusb.brd: rearranged component references and values for
printing/display
- atusb.brd: bumped version to 20110214
- atusb.brd: moved C14 and adjacent via 10 mil away from the transceive,
for improved solderability
- atusb.brd: moved nRST_RF via and trace by 5 mil, for better access to
the trace
- atusb.brd: reduced crystal front ground zone such that it does not
creep under XTAL2 corner (where it might meet exposed metal)
- usb.sch: cleaned up programming/auxiliary/LED signals
- usb.sch: swapped LED and nRST_RF (tracking the layout)
- atusb.brd: updated for corrected netlist
- atusb.brd: moved date code which overlapped with traces
- atusb.brd: reduced front RF and power ground zones to avoid ground
fill between transceiver pads
- atusb.brd: added ground traces around crystal to widen ground zone
- atusb.pro, atusb.cmp: updated for ATmega32U2-based design
- usb.sch: rearranged LED, nRST_RF, and SLP_TR, to make layout easier
- atusb.brd: redid layout for the ATmega32U2-based design
Settings according to
http://www.nxp.com/documents/mounting_and_soldering/AN10365.pdf
- atben.pro, atben.brd, atusb.pro, atusb.brd: set solder mask clearance
to 50 um (copper-defined pads)
- atben.pro, atben.brd, atusb.pro, atusb.brd: set solder paste clearance
to 25 um
- atusb.brd: moved component references for proper printing on silk screen
- atusb.brd: moved component values for easy display (do not print on
silk screen !)
- atusb.brd, atusb.cmp: changed all 0402-M to the new 0402
- atusb.brd, atusb.cmp: changed 0603-M to the new 0603
- atusb.brd: updated layout for component changes
- atrf.sch: replaced the AT86RF230 with the AT86RF231
- atusb.sch, usb.sch, atrf.sch: removed TST signal
- atrf.sch: grounded former TST pin
- atusb.brd: updated for TST removal
- atusb.brd: increased space between SLP_TR and nRST_RF vias
- atusb.brd: connect U2 pin 6 to ground pad
- atusb.sch, usb.sch, atrf.sch, atusb.brd: changed version to 20110104
- atusb.brd: increased RF ground zone by 150 mil in an attempt to reduce
interferences between the the antenna and the rest of the circuit
- atusb.brd: added more vias around and inside the RF ground zone
- atusb.brd: set version to 20110102
Traces leaving a pad on the side may invite solder bridges to "false pads"
exposed at the edges of the chip, with unknown consequences.
- atusb.brd: make trace from P0.0 (IRQ_RF) leave pad at the front, not
at the side
- atusb.brd: make trave from P0.7 (SCLK) leave pad at front, not at the
side
- atusb.brd: nRST may need an external pull-up to VDD. Added via to bring
nRST and VDD within reach (pull-up suggested by Joerg Reisenweber)
- atusb.brd: increased version to 20101229
- atusb.brd: increase clearance between RF clock front ground area and MCU
(ground area acted as solder trap)
- atusb.brd: route nRST_RF trace out of corner (to avoid accidental
contact)
- atusb.brd: don't route VBUS corner trace underneat chip (for general
tidiness)
- atusb.brd: bumped version to 20101219
- atusb.brd: reduced RF front ground area to avoid interconnections very
close to the chip
- atusb.brd: reduced RF power front ground area to avoid interconnections
very close to the chip
- atusb.brd: moved via next to TXRX pad 18 (GND) to make room for making
CLK trace leave the pad at its end, not at its side
- atusb.brd: bumped design date to 20101217
