- modules/usb_a_plug_smt.fpd: enlarged hole for positioning pins from
1.1 mm to 1.15 mm
- atusb/usb.sch, atusb/atusb.cmp, atusb/atusb.brd: removed trailing space
from CON1's value
- atusb/atusb.sch, atusb/usb.sch, atusb/atrf.sch: schematics title still
said AT86RF230, not 231
- atusb/README-SMT: corrected a typo
- atusb/README-PCB: specified the tolerance of the hole for the positioning
pins of the USB connector
- atusb/README-PCB: added the 16-17 mm hole for the USB connector to the
specification
- atusb/: bumped all version numbers to 20110330
- README-Ben: patch kernel with -p1
- README-Ben: forgot the vmlinuz.bin compression step
- README-Ben: mkimage line differs for Jlime (mipsel-*-nm)
- README-Ben: mention expected result of address detection
- README-Ben: updating the kernel from Linux needs a ^C at the end
- README-Ben: cleaned up and clarified user space setup
- README-Ben: use readlink -f in case mipsel-openwrt-linux-gcc isn't
symlinked
- README-Ben, libnl-1.1-limits.patch: fix missing #include on Jlime
- README-Ben: Jlime needs a different prefix discovery algorithm
- atben/README-SMT, atusb/README-SMT: added "component to "orientation"
- atben/README-SMT, atusb/README-SMT: added "drawings" to "footprint
reference"
- atben/README-SMT, atusb/README-SMT: mention once more that the automatic
insertion file is for the front only
- atben/atben.brd, atusb/atusb.brd: set solder mask clearance of fiducials
to 0.1 mil, so that the real solder mask opening has a diameter of
almost) exactly 2 mm (instead of 2 mm plus 10 mil)
- atusb.pro: added fiducial.mod
- atusb.brd: added two fiducial marks
- atusb.brd: adjusted RF and RF power ground zones
- atusb.brd (CON1): moved component reference out of the way
- atusb.brd: bumped version to 110323
- atusb.brd (C22): properly aligned reference with component center
- atusb.brd (P11, P12, P13, P14): moved reference below the pad, for
consistency with P15 and P16
- atusb.brd (CON1): centered the component reference
- atben.pro: added fiducial.mod
- atben.brd: added two fiducial marks
- atben.brd: adjusted and straightened upper left of the RF ground zones
- atben.brd: bumped version to 110323
- makefiles/Makefile.kicad ($(NAME)-PCB_Edges.dxf, $(NAME).drl): since we
now name the files explicitly, we need to generate them explicitly as
well
- makefiles/Makefile.kicad (upload): added SMT fab package
- atben/Makefile (VERSION), atusb/Makefile (VERSION): bumped fab file
version to 110323
- Makefile.kicad (fab-pcb): add explicit dependency instead of "gerber"
- Makefile.kicad (fab-smt): depend on all files, not just the .csv files
- Makefile.kicad (clean): also remove $(NAME)-bom.csv
- atben/README-PCB, atusb/README-PCB: added overview images for PCB front
and back
- atben/README-SMT, atusb/README-SMT: added overview image for PCB front
- atben/README-SMT, atusb/README-SMT: clarified that the Gerbers are in
the PCB archive
- makefiles/Makefile.kicad (PCB_FILES): moved list of gerbers to
$(GERBERS)
- makefiles/Makefile.kicad (gerber): generate Gerbers only if necessary
- makefiles/Makefile.kicad (overview, uoverview, clean): renamed
overview.png to $(NAME)-overview.png and turned phony target into file
target
- makefiles/Makefile.kicad ($(NAME)-front.png, $(NAME)-back.png, clean):
added generation of front and back images
- atben/README-SMT, atusb/README-SMT: description for SMT fab files
- bom/Makefile (%-smt.csv, spotless): renamed *-smt.csv to *-bom.csv
- makefiles/Makefile.kicad (fab): split into "fab" (PCB and SMT) and
fab-pcb (previous "fab"; only PCB)
- makefiles/Makefile.kicad (fab-smt): added packaging process for SMT
fab files
- Makefile.kicad ($(NAME)Front.pos): --origin does nothing with --pos;
removed it
- Makefile.kicad ($(NAME)-pos.csv): use pos2fab to generate a positioning
file for the SMT fab
- Makefile.kicad (clean): remove $(NAME)Front.pos and $(NAME)-pos.csv
Note that QFN28-Atmel and QFN28-SiLabs still need verifying.
QFN28-SiLabs is quite differnt from NXP's specification.
- modules/INFO: added description of solder paste deposit dimensioning
rules (based on NXP's AN10365)
- modules/qfn.fpd (QFN32-VHHD-2, QFN32-VHHD-6): increased solder paste
deposits according to the rules
- Makefile (overview): run prettygerbv to generate an overview image
- Makefile (uoverview): copy the overview image to
downloads.qi-hardware.com and version it
- Makefile (clean): remove overview.png
- atben/Makefile (gerbv), atusb/Makefile (gerbv): show also the back
solder mask layer
- atben/README-PCB, atusb/README-PCB: don't claim the back solder mask
is empty
- atben/Makefile, atusb/Makefile (SCH, BRD): abstract path to .sch and
.brd via variables
- atben/Makefile, atusb/Makefile (gerber, fab): pass absolute path to
board file to pcbnew
- atben/Makefile, atusb/Makefile (gerber): put all options before the
file name argument
- atusb.brd: enabled Drawings layer
- atusb.brd: moved board dimensions to Drawings layer
- Makefile (clean): added $(NAME)-Drawings.gbr
- Makefile (GMERGE, gerber): use "gmerge" to merge Comments (which now
only contains the component references) into SilkS_Front
- Makefile (gerbv): Comments is now redundant; removed it
