Production and testing

This document gives a high-level description of the production test process for atben and atusb boards, plus - in the case of atusb the production steps required between the boards leaving the SMT line and the actual testing.

The testing serves two purposes:

  1. Ascertain the correctness of the preceding production steps, and
  2. identify suffering from random production flaws and either discard them or prepare them for repair.
The results of testing and fault analysis also provide feedback for the SMT process and steps preceding it.

The following diagram illustrates the workflow:

Only atusb boards contain firmware and need flashing (which is a two-step process, see below). The functional tests and further fault analysis are largely the same for atben and atusb.

Devices accepted for further use can then be packaged for shipping. Defective devices can be discarded or retained for a deeper analysis.

Terminology

Ben
a device capable of hosting the atben and atusb-pgm boards. In the production process, a Ben can perform three different roles:
  1. Host an atben board acting as DUT
  2. Host an atben board acting as reference
  3. Host an atusb-pgm used for flashing the boot loader
In this document, we assume that a single Ben is used in all three roles, with the board in its 8:10 card slot changed as the role requires.
PC
a device capable of connecting to a Ben via USB, and of hosting an atusb board. In the production process, a PC can perform three different roles:
  1. Host an atusb board acting as DUT
  2. Host an atusb board acting as reference
  3. Control a Ben via USB (for convenience)
In this document, we assume that a single PC is used in all three roles, with one USB host port permanently connecting to the Ben, and a second USB host port populated with atusb boards as needed.
DUT
Device Under Test. An atben or atusb board that has left SMT, and is being prepared for testing or in the process of being tested.
Reference
An atben or atusb device that is known to work and and that acts as a peer for RF communication with the DUT.
SMT
In this context, the actual process of soldering components to the unpopulated PCB, and all related tasks providing an input to this process. Such related tasks include the configuration of the SMT line, and testing and conditioning of the components prior to soldering.

Detailed description

The following pages describe the preparation and the execution of the production and test process:

Last update: 2011-05-18  Werner Almesberger