Board characteristics: - stacking: 2 layers, solder mask on front and back, silk screen on front - board material: FR4, thickness 0.8 mm (1/32"), 1 oz copper - surface finish: TBD, ENIG is preferred - via holes: diameter is nominally 10 mil, but any size <= 15 mil can be used - ground via of the antenna: diameter is nominally 8 mil, but any size <= 15 mil can be used - mechanical tolerances: <= +/- 0.1 mm on all sides Layer stacking, from top to bottom: atusb-SilkS_Front.gto Front silk screen atusb-Mask_Front.gts Front solder mask atusb-Front.gtl Front copper atusb-Back.gbl Back copper atusb-Mask_Back.gbs Back solder mask Other design files: atusb-front.png Illustration of the PCB's front side (without holes) atusb-back.png idem, for the back side atusb-PCB_Edges.gbr Board edges, for routing (Gerber) atusb.dxf idem (AutoCAD DXF) atusb.drl Excellon drill file atusb-SoldP_Front.gtp Front solder paste, for stencil Interpretation of files: - for all coordinates, the origin is the lower left corner of the board - do not print component values on silk screen - the center (!) of the board edge line marks the true board edge, e.g., Edge line (5 mil) ======= ------- - - - - - ---------- | | PCB outside | | PCB inside | | ------- - - - - - ---------- | Volume removed when cutting (width depends on tool used)