mirror of
git://projects.qi-hardware.com/ben-wpan.git
synced 2024-12-23 18:27:42 +02:00
28e2c757bc
- AUTHORS, modules/INFO, modules/Makefile, modules/pads.fpd: added pads - modules/Makefile: added forgotten "qfn" module - modules/xtal-4.fpd: renamed crystal module from xtal-4-* to xtal4-*, for clarity
47 lines
1.2 KiB
Plaintext
47 lines
1.2 KiB
Plaintext
#
|
|
# Tags:
|
|
#
|
|
# F Footprint name (must be first)
|
|
# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
|
|
#
|
|
|
|
# TI meandered inverted F antenna
|
|
F: meander
|
|
N: AN043
|
|
|
|
# Mini-USB B receptable (SMT; almost generic)
|
|
F: mini_usb_b
|
|
|
|
# Standard rectangular passive components
|
|
F: stdpass
|
|
|
|
# "Generic" simple QFN
|
|
F: qfn
|
|
#
|
|
# The information for these packages comes from various sources:
|
|
#
|
|
# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
|
|
# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
|
|
# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
|
|
# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
|
|
# http://www.nxp.com/package/SOT617-1.html
|
|
# http://www.nxp.com/package/SOT617-3.html
|
|
#
|
|
# Known bugs:
|
|
#
|
|
# - we should distribute the solder paste in an array of small
|
|
# squares instead of just covering the whole center pad.
|
|
# - really ought to merge all the various QFN definitions (we have more
|
|
# over at gta02-core) into a single QFN file with a big mean table of
|
|
# everything
|
|
#
|
|
N: sot617-3-lp
|
|
|
|
# Common 4-pin crystal SMT package (pins 1 and 4 are on a short side, pin
|
|
# numbering is counter-clockwise)
|
|
F: xtal-4
|
|
N: nx3225sa
|
|
|
|
# Solder pads and test points
|
|
F: pads
|