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ben-wpan/modules/INFO
Werner Almesberger 28e2c757bc Added modules for test points and solder pads. Some cleanup.
- AUTHORS, modules/INFO, modules/Makefile, modules/pads.fpd: added pads
- modules/Makefile: added forgotten "qfn" module
- modules/xtal-4.fpd: renamed crystal module from xtal-4-* to xtal4-*, for
  clarity
2010-08-12 15:28:03 -03:00

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#
# Tags:
#
# F Footprint name (must be first)
# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
#
# TI meandered inverted F antenna
F: meander
N: AN043
# Mini-USB B receptable (SMT; almost generic)
F: mini_usb_b
# Standard rectangular passive components
F: stdpass
# "Generic" simple QFN
F: qfn
#
# The information for these packages comes from various sources:
#
# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
# http://www.nxp.com/package/SOT617-1.html
# http://www.nxp.com/package/SOT617-3.html
#
# Known bugs:
#
# - we should distribute the solder paste in an array of small
# squares instead of just covering the whole center pad.
# - really ought to merge all the various QFN definitions (we have more
# over at gta02-core) into a single QFN file with a big mean table of
# everything
#
N: sot617-3-lp
# Common 4-pin crystal SMT package (pins 1 and 4 are on a short side, pin
# numbering is counter-clockwise)
F: xtal-4
N: nx3225sa
# Solder pads and test points
F: pads