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git://projects.qi-hardware.com/ben-wpan.git
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6487c32387
- atben/README-PCB, atusb/README-PCB: illustrations now contain holes - atben/README-PCB, atusb/README-PCB: clarified distinction antenna via vs. hole
47 lines
1.5 KiB
Plaintext
47 lines
1.5 KiB
Plaintext
Board characteristics:
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- stacking: 2 layers, solder mask on front and back, silk screen on front
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- board material: FR4, thickness 0.8 mm (1/32"), 1 oz copper
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- surface finish: TBD, ENIG is preferred
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- via holes: diameter is nominally 10 mil, but any size <= 15 mil can be used
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- ground via of the antenna: hole diameter is nominally 8 mil, but any size
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<= 15 mil can be used
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- mechanical tolerances: <= +/- 0.1 mm on all sides
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Layer stacking, from top to bottom:
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atusb-SilkS_Front.gto Front silk screen
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atusb-Mask_Front.gts Front solder mask
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atusb-Front.gtl Front copper
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atusb-Back.gbl Back copper
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atusb-Mask_Back.gbs Back solder mask
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Other design files:
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atusb-front.png Illustration of the PCB's front side
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atusb-back.png idem, for the back side
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atusb-PCB_Edges.gbr Board edges, for routing (Gerber)
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atusb.dxf idem (AutoCAD DXF)
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atusb.drl Excellon drill file
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atusb-SoldP_Front.gtp Front solder paste, for stencil
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Interpretation of files:
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- for all coordinates, the origin is the lower left corner of the board
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- do not print component values on silk screen
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- the center (!) of the board edge line marks the true board edge, e.g.,
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Edge line (5 mil)
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=======
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------- - - - - - ----------
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PCB outside | | PCB inside
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------- - - - - - ----------
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Volume removed when cutting
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(width depends on tool used)
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