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bb055fa209
This is for thermal vias and the unusual grounding method NXP use in their HVQFN33 footprints.
19 lines
491 B
C
19 lines
491 B
C
/*
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* hole.h - Classify holes and connect them with pads
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*
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* Written 2010, 2012 by Werner Almesberger
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* Copyright 2010, 2012 by Werner Almesberger
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*
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* This program is free software; you can redistribute it and/or modify
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* it under the terms of the GNU General Public License as published by
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* the Free Software Foundation; either version 2 of the License, or
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* (at your option) any later version.
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*/
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#ifndef HOLE_H
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#define HOLE_H
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int link_holes(int linked);
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#endif /* !HOLE_H */
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