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2010-10-25 05:41:51 +03:00
#
# Tags:
#
# F Footprint name (must be first)
# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
#
# Standard rectangular passive components
F: stdpass
# Solder pads and test points
F: pads
# Printed 8:10 card contacs
F: 8_10-card
# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
F: fiducial
# "Generic" simple QFN
F: qfn
#
# The information for these packages comes from various sources:
#
# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
# http://www.nxp.com/package/SOT617-1.html
# http://www.nxp.com/package/SOT617-3.html
#
# Solder paste:
#
# Footprint Center pad Closest NXP (with complete land pattern)
# QFN28-Atmel 2.4 mm for further study
# QFN28-SiLabs 3.3 mm use SiLab's specification
# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
# QFN32-VHHD-6 3.4 mm SOT818-1
#
# From NXP:
#
# Package Pad Paste zone Islands Isl. size Isl. gap
# SiLabs 3.25 3.1 3 x 3 0.9
# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
#
# NXP rules (AN10365):
# - paste zone = 35% of pad area
# - paste coverge = 20% of pad area
#
# Our parameters:
#
# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
#
# Known bugs:
#
# - really ought to merge all the various QFN definitions (we have more
# over at gta02-core) into a single QFN file with a big mean table of
# everything
#
N: sot617-3-lp
# "Generic" simple QFP (for now, just for Silabs' C8051F320)
F: qfp
# Mini-USB B receptable (SMT; almost generic)
F: mini_usb_b
# USB A plug for SMT
#
# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
# 0.1 mm with respect to the reference.
#
# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
# 3.5 mm.
#
# Assuming that the pad is intended to extend a bit beyond the lead, we need
# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
# be intended to be used this way, however, we still have to consider small
# errors in registration, which also amount to about 0.1 mm, so the calculation
# remains valid.)
#
F: usb_a_plug_smt
# USB 2.0 from usb_20_040908, page 99
F: usb-a-pcb
# SOT-323 package with counter-clockweise or clockwise pin assignment
F: sot-323
N: mmst3904
# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
F: ssop
# experimental generic SOT footprint; currently only for
#
# - SOT-323 aka SC-70
# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
# - SOT-363 aka SC-88 aka SC-70-6
# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
# - SOT-523
# http://www.diodes.com/datasheets/ds31784.pdf
# - SOT-563
# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
#
# some conflicts with the outline exist
F: sot
2012-05-23 06:00:06 +03:00
# MDIP
F: mdip
#
# From FAIRCHILD:
#
# - the 6N138S data sheet
# http://www.fairchildsemi.com/ds/6N/6N138.pdf
#
# Package Type:
#
# - MDIP 8L
# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
#
# Package Drawing:
#
# http://www.fairchildsemi.com/dwg/N0/N08H.pdf