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mic-ra-dip.fpd: added package of MIC-RA-DIP-${Dia}x${Height}

This commit is contained in:
Adam Wang 2012-06-15 11:13:44 +08:00
parent e33374c46f
commit 3a6c44160d
2 changed files with 54 additions and 0 deletions

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@ -155,6 +155,15 @@ F: mdip
# http://focus.ti.com/lit/an/swra117d/swra117d.pdf # http://focus.ti.com/lit/an/swra117d/swra117d.pdf
F: meander-2.4GHz F: meander-2.4GHz
# Microphone, through hole type, bent pins
F: mic-ra-dip
#
# - MIC-RA-DIP-${Dia}x${Height}: for example PRO SIGNAL the MP33125 data sheet, package drawing
# http://www.farnell.com/datasheets/359234.pdf
# be noted that placements of two pins based on bending pins to suitable right angle purpose.
# the py# is the option to change to distance that you want.
#
# Mini-USB B receptable (SMT; almost generic) # Mini-USB B receptable (SMT; almost generic)
F: mini_usb_b F: mini_usb_b

45
modules/mic-ra-dip.fpd Normal file
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@ -0,0 +1,45 @@
/* MACHINE-GENERATED ! */
frame outline {
__0: vec @(-Dia/2, Height/2)
__2: vec .(Dia, py+factor*hole/2+2*w)
rect . __0 w
__1: vec @(Dia/2, -Height/2)
rect __0 . w
}
frame pins {
table
{ n, dx }
{ 1, -1 }
{ 2, 1 }
__0: vec @(0mm, Height/2+py)
__1: vec .(dx*Pitch/2, 0mm)
__2: vec .(hole/2, hole/2)
__3: vec __1(-hole/2, -hole/2)
hole . __2
__4: vec __1(factor*hole/2, -factor*hole/2)
__5: vec __1(-factor*hole/2, factor*hole/2)
rpad "$n" . __4
}
package "MIC-RA-DIP-${Dia}x${Height}"
unit auto
table
{ Dia, Height, Pitch, py }
{ 9.7mm, 6.7mm, 2.54mm, 1.5mm }
set w = 5mil
set hole = 0.9mm
set factor = 1.7
frame outline @
frame pins @
measy outline.__1 >> outline.__0 -1mm
measx outline.__0 >> outline.__1 -(Height+1mm)
meas pins.__1 >> pins.__1 2mm
measx pins.__3 -> pins.__2 -factor*hole/2