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modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare"

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Rationale: if soldering in the SMT process, one probably wants to check
the TH pads anyway, so there is little point in putting solder paste on
them with the hope that some may stick.

If soldering in a separate TH process, solder paste could clog the holes.
This commit is contained in:
Werner Almesberger 2012-07-19 00:04:29 -03:00
parent 9be533bcdc
commit c0e33e5872
1 changed files with 1 additions and 1 deletions
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modules/usb_a_plug_smt.fpd
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@ -44,7 +44,7 @@ frame shield {
__0: vec @(x, 0mm)
__1: vec .(wo/2, ho/2)
__2: vec __0(-wo/2, -ho/2)
rpad "$name" . __1
rpad "$name" . __1 bare
__3: vec __0(wi/2, hi/2)
__4: vec __0(-wi/2, -hi/2)
hole . __3