From c0e33e587211ab4e9fa5b6cf4bb4b9fc5ec79113 Mon Sep 17 00:00:00 2001
From: Werner Almesberger <werner@almesberger.net>
Date: Thu, 19 Jul 2012 00:04:29 -0300
Subject: [PATCH] modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH
 pads to "bare"

Rationale: if soldering in the SMT process, one probably wants to check
the TH pads anyway, so there is little point in putting solder paste on
them with the hope that some may stick.

If soldering in a separate TH process, solder paste could clog the holes.
---
 modules/usb_a_plug_smt.fpd | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/modules/usb_a_plug_smt.fpd b/modules/usb_a_plug_smt.fpd
index ebb3ecd..c514889 100644
--- a/modules/usb_a_plug_smt.fpd
+++ b/modules/usb_a_plug_smt.fpd
@@ -44,7 +44,7 @@ frame shield {
 	__0: vec @(x, 0mm)
 	__1: vec .(wo/2, ho/2)
 	__2: vec __0(-wo/2, -ho/2)
-	rpad "$name" . __1
+	rpad "$name" . __1 bare
 	__3: vec __0(wi/2, hi/2)
 	__4: vec __0(-wi/2, -hi/2)
 	hole . __3