# # Tags: # # F Footprint name (must be first) # N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F) # # Printed 8:10 card contacs F: 8_10-card # EUS (R-PDSS-T6) F: eus # # - for example: the PTH04000WAH data sheet, it's EUS # http://www.ti.com/lit/ds/symlink/pth04000w.pdf # # Fiducial (1 mm copper pad, 2 mm solder mask clearance) F: fiducial # IR Receiver Module F: ir # # From Vishay: # # - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet # http://www.vishay.com/docs/81732/tsop348.pdf # MDIP F: mdip # # From FAIRCHILD: # # - the 6N138S data sheet # http://www.fairchildsemi.com/ds/6N/6N138.pdf # # Package Type: # # - MDIP 8L # http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08 # # Package Drawing: # # http://www.fairchildsemi.com/dwg/N0/N08H.pdf # Mini-USB B receptable (SMT; almost generic) F: mini_usb_b # Solder pads and test points F: pads # "Generic" simple QFN F: qfn # # The information for these packages comes from various sources: # # - the C8051F326 data sheet, for the QFN28 footprint (N: mcu) # - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx) # - Atmel's general recommendations for QFN land patterns (N: atmel-qfn) # - NXP's SOT617-1 and SOT617-3, for package and land pattern: # http://www.nxp.com/package/SOT617-1.html # http://www.nxp.com/package/SOT617-3.html # # Solder paste: # # Footprint Center pad Closest NXP (with complete land pattern) # QFN28-Atmel 2.4 mm for further study # QFN28-SiLabs 3.3 mm use SiLab's specification # QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1 # QFN32-VHHD-6 3.4 mm SOT818-1 # # From NXP: # # Package Pad Paste zone Islands Isl. size Isl. gap # SiLabs 3.25 3.1 3 x 3 0.9 # SOT818-1 3.4 1.75 2 x 2 0.75 0.25 # SOT788-1 4.0 2.4 3 x 3 0.6 0.3 # # NXP rules (AN10365): # - paste zone = 35% of pad area # - paste coverge = 20% of pad area # # Our parameters: # # Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage # QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20% # QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19% # # Known bugs: # # - really ought to merge all the various QFN definitions (we have more # over at gta02-core) into a single QFN file with a big mean table of # everything # N: sot617-3-lp # "Generic" simple QFP (for now, just for Silabs' C8051F320) F: qfp # # - the C8051F320 data sheet # http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf # # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ # the LQPF48/TQFP48 referred to the same package drawing and land pattern # # - LQFP48, TQFP48: C48 -> package drawing # http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF # # - LQFP48, TQFP48: C48 -> package land pattern # http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF # # SOIC F: soic # # From TI: # # - the SN75HVD12DR data sheet # http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf # # Package Drawing: # # - D(JEDEC) # - R-PDSO-G8 # http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf # - R-PDSO-G14 # http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf # - R-PDSO-G16 # http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf F: sot # Standard rectangular passive components F: stdpass # SOT-323 package with counter-clockweise or clockwise pin assignment F: sot-323 N: mmst3904 # http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml] # http://www.nxp.com/packages/SOT341-1.html # http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf F: ssop # experimental generic SOT footprint; currently only for # # - SOT-323 aka SC-70 # http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF # - SOT-363 aka SC-88 aka SC-70-6 # http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF # - SOT-523 # http://www.diodes.com/datasheets/ds31784.pdf # - SOT-563 # http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF # # some conflicts with the outline exist # "Generic" simple TSOP F: tsop # # - the JS28F256J3F105 data sheet, it's TSOP-56 # http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx # # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ # the TSOP32 referred to the same package drawing and land pattern # # - TSOP28: Z28 -> package drawing # http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF # # - TSOP28: Z28 -> package land pattern # http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF # # # - TSOP32: Z32 -> package drawing # http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF # # - TSOP32: Z32 -> package land pattern # http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF # # "Generic" simple TO-252, TO-263 F: to # # - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252 # http://www.ti.com/lit/ds/symlink/lp38690.pdf # # - JEDEC Spec: TO-252 AA -> package drawing and land pattern # http://www.national.com/packaging/mkt/td03b.pdf # # - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263 # http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf # # - JEDEC Spec: TO-263 THIN -> package drawing and land pattern # http://www.national.com/packaging/mkt/tj5a.pdf # # USB A plug for SMT # # Note: the signal pads are enlarged by 0.2 mm and their center is shifted by # 0.1 mm with respect to the reference. # # According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+ # 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the # edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the # maximum lead end could be at 3.58 mm while the minimum pad edge could be at # 3.5 mm. # # Assuming that the pad is intended to extend a bit beyond the lead, we need # to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not # be intended to be used this way, however, we still have to consider small # errors in registration, which also amount to about 0.1 mm, so the calculation # remains valid.) # F: usb_a_plug_smt # USB 2.0 from usb_20_040908, page 99 F: usb-a-pcb