mirror of
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301 lines
9.0 KiB
Plaintext
301 lines
9.0 KiB
Plaintext
#
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# Tags:
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#
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# F Footprint name (must be first)
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# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
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#
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# Printed 8:10 card contacs
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F: 8_10-card
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# BGA
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F: bga
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# - 484-Pin FineLine BGA(FBGA), from Altera
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# http://www.altera.com/devicepackaging/04R00416-02.pdf
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#
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# - FG(G)484 Fine-Pitch BGA, from Xilinx
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# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
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#
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# DO-214
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F: do-214
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#
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# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
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# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
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#
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# - DO-214AB(SMC), from Fairchild
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# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
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#
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# - DO-214AC(SMA), from Fairchild
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# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
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#
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# EUS (R-PDSS-T6)
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F: eus
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#
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# - for example: the PTH04000WAH data sheet, it's EUS
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# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
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#
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# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
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F: fiducial
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# IR Receiver Module
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F: ir
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#
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# From Vishay:
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#
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# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
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# http://www.vishay.com/docs/81732/tsop348.pdf
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# LED right angle package
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F: ledsmd
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#
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# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
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# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
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# added a letter 'R' stands for right angle land pattern
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# could expand it as else land pattern for 0603, 0805, 0805R, etc.
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#
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# MDIP
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F: mdip
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#
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# From FAIRCHILD:
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#
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# - the 6N138S data sheet
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# http://www.fairchildsemi.com/ds/6N/6N138.pdf
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#
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# Package Type:
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#
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# - MDIP 8L
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# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
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#
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# Package Drawing:
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#
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# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
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# Mini-USB B receptable (SMT; almost generic)
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F: mini_usb_b
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# Solder pads and test points
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F: pads
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# "Generic" simple QFN
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F: qfn
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#
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# The information for these packages comes from various sources:
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#
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# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
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# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
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# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
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# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
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# http://www.nxp.com/package/SOT617-1.html
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# http://www.nxp.com/package/SOT617-3.html
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#
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# Solder paste:
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#
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# Footprint Center pad Closest NXP (with complete land pattern)
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# QFN28-Atmel 2.4 mm for further study
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# QFN28-SiLabs 3.3 mm use SiLab's specification
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# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
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# QFN32-VHHD-6 3.4 mm SOT818-1
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#
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# From NXP:
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#
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# Package Pad Paste zone Islands Isl. size Isl. gap
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# SiLabs 3.25 3.1 3 x 3 0.9
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# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
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# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
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#
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# NXP rules (AN10365):
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# - paste zone = 35% of pad area
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# - paste coverge = 20% of pad area
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#
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# Our parameters:
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#
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# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
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# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
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# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
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#
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# Known bugs:
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#
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# - really ought to merge all the various QFN definitions (we have more
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# over at gta02-core) into a single QFN file with a big mean table of
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# everything
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#
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N: sot617-3-lp
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# "Generic" simple QFP (for now, just for Silabs' C8051F320)
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F: qfp
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#
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# - the C8051F320 data sheet
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# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
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#
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# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
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# the LQPF48/TQFP48 referred to the same package drawing and land pattern
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#
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# - LQFP48, TQFP48: C48 -> package drawing
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# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
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#
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# - LQFP48, TQFP48: C48 -> package land pattern
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# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
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#
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# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
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# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
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#
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# - LQFP64, C64 -> package drawing
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# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
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#
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# - LQFP64, C64 -> package land pattern
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# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
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#
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# SOIC
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F: soic
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#
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# From TI:
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#
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# - the SN75HVD12DR data sheet
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# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
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#
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# Package Drawing:
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#
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# - D(JEDEC)
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# - R-PDSO-G8
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# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
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# - R-PDSO-G14
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# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
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# - R-PDSO-G16
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# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
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# SOT generic package
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F: sot
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# experimental generic SOT footprint; currently only for
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#
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# - SOT-323 aka SC-70
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# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
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# - SOT-363 aka SC-88 aka SC-70-6
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# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
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# - SOT-523
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# http://www.diodes.com/datasheets/ds31784.pdf
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# - SOT-563
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# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
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#
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# some conflicts with the outline exist
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# SOT23 generic package with counter-clockweise or clockwise pin assignment
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F: sot23
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#
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# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
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# http://www.diodes.com/datasheets/APX803.pdf
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#
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# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
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# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
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#
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# Standard rectangular passive components
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F: stdpass
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# SOT-323 package with counter-clockweise or clockwise pin assignment
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F: sot-323
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N: mmst3904
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# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
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# http://www.nxp.com/packages/SOT341-1.html
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# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
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# "Generic" simple SSOP
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F: ssop
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#
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# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
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# http://www.micrel.com/_PDF/mic2550a.pdf
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#
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# - TSSOP14: from NXP -> package land pattern
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# http://www.nxp.com/packages/SOT402-1.html
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# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
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# "Generic" simple TO-252, TO-263
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F: to
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#
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# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
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# http://www.ti.com/lit/ds/symlink/lp38690.pdf
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#
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# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
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# http://www.national.com/packaging/mkt/td03b.pdf
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#
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# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
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# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
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#
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# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
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# http://www.national.com/packaging/mkt/tj5a.pdf
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#
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# "Generic" simple TSOP
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F: tsop
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#
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# - TSOP28: Z28 -> package drawing
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# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
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#
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# - TSOP28: Z28 -> package land pattern
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# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
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#
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# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
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# the TSOP32 referred to the same package drawing and land pattern
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#
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# - TSOP32: Z32 -> package drawing
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# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
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#
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# - TSOP32: Z32 -> package land pattern
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# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
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#
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# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
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# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
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#
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# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
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# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
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#
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# - TSOP66: currently referred to M1rc3 design files land pattern:
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# width of pad -> 0.4 mm, it's rectangle not round one
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# length of pad -> 1.25 mm
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# Width of body -> 400 mil
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# TSSOP5 for NXP
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F: tssop5
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#
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# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
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# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
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# http://www.nxp.com/packages/SOT353-1.html
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# but without real land pattern found, still could refer link below for more in details:
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# http://www.nxp.com/documents/application_note/AN10365.pdf
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#
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# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
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# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
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#
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# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
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# could use a land pattern of pad length to be 0.7 mm.
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#
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# USB A plug for SMT
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#
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# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
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# 0.1 mm with respect to the reference.
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#
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# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
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# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
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# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
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# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
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# 3.5 mm.
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#
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# Assuming that the pad is intended to extend a bit beyond the lead, we need
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# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
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# be intended to be used this way, however, we still have to consider small
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# errors in registration, which also amount to about 0.1 mm, so the calculation
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# remains valid.)
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#
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F: usb_a_plug_smt
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# USB 2.0 from usb_20_040908, page 99
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F: usb-a-pcb
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