Some SMT packages used for 74xxx1G devices (4 contacts)

Package name	Width x Depth		Lead to Lead	Pitch	Leads/Pkg

TI YFP		0.74|0.80x0.74|0.80			0.40	4 BGA

There are more packages, see 1g-dyadic

Sources:
http://www.nxp.com/documents/data_sheet/74AUP1G07.pdf
http://focus.ti.com/lit/ds/symlink/sn74aup1g07.pdf
