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+Some SMT packages used for 74xxx1G devices (5-6 contacts)
+
+Package name	Width x Depth		Lead to Lead	Pitch	Leads/Pkg
+
+TI  DBV		1.45|1.75x2.75|3.05	2.6|3.00	0.95 	5
+
+TI  DCK		1.10|1.40x1.85|2.25	1.8|2.40	0.65 	5
+NXP GW/SOT353-1	1.15|1.35x1.85|2.25	2.0|2.25	0.65 	5
+
+TI  DRL		1.50|1.70x1.10|1.30	1.50|1.70	0.50	5
+
+TI  DRY		0.95|1.05x1.40|1.50			0.50	6 NL
+NXP GM/SOT886	0.95|1.05x1.40|1.50			0.50	6 NL
+
+TI  DSF		0.95|1.05x0.95|1.05			0.35	6 NL
+NXP GF/SOT891	0.95|1.05x0.95|1.05			0.35	6 NL
+NXP GS/SOT1115	0.85|0.95x0.85|0.95			0.55	6 NL
+
+NXP GN/SOT1202	0.95|1.05x0.95|1.05			0.55	6 NL
+
+TI  YZP		0.85|0.95x1.35|1.45			0.50	5 BGA
+
+TI  YFP		0.74|0.80x1.14|1.20			0.40	6 BGA
+
+Pkg: NL = no lead (contacts may be accessible with a narrow probe)
+     BGA = contacts inaccessible
+
+Sources:
+http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
+http://focus.ti.com/lit/ds/symlink/sn74aup1g08.pdf