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31 lines
883 B
Plaintext
31 lines
883 B
Plaintext
Some SMT packages used for 74xxx1G devices (5-6 contacts)
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Package name Width x Depth Lead to Lead Pitch Leads/Pkg
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TI DBV 1.45|1.75x2.75|3.05 2.6|3.00 0.95 5
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TI DCK 1.10|1.40x1.85|2.25 1.8|2.40 0.65 5
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NXP GW/SOT353-1 1.15|1.35x1.85|2.25 2.0|2.25 0.65 5
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TI DRL 1.50|1.70x1.10|1.30 1.50|1.70 0.50 5
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TI DRY 0.95|1.05x1.40|1.50 0.50 6 NL
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NXP GM/SOT886 0.95|1.05x1.40|1.50 0.50 6 NL
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TI DSF 0.95|1.05x0.95|1.05 0.35 6 NL
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NXP GF/SOT891 0.95|1.05x0.95|1.05 0.35 6 NL
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NXP GS/SOT1115 0.85|0.95x0.85|0.95 0.55 6 NL
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NXP GN/SOT1202 0.95|1.05x0.95|1.05 0.55 6 NL
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TI YZP 0.85|0.95x1.35|1.45 0.50 5 BGA
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TI YFP 0.74|0.80x1.14|1.20 0.40 6 BGA
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Pkg: NL = no lead (contacts may be accessible with a narrow probe)
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BGA = contacts inaccessible
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Sources:
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http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
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http://focus.ti.com/lit/ds/symlink/sn74aup1g08.pdf
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