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This commit is contained in:
Andres Calderon
2010-07-24 06:58:53 -05:00
commit d6f7c20935
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2Gb DDR2 SDRAM IBIS models
The u49a IBIS models include On Die Termination (ODT) characteristics. ODT is
modeled through the use of [Submodel] power and ground clamp I-V curves that
add the termination characteristics to the regular power and ground clamp
characteristics when the I/O is functioning as an input. ODT applies to the
DQ, DQS/DQS#, RDQS/RDQS#, and DM signals. Use the [Model Selector] to choose
between 50, 75, or 150 ohm ODT settings.
NOTE: C_comp is lower for the ODT-enabled models versus the normal I/O model.
The C_comp value is set to match the input state of the DQ I/O as measured from
the HSPICE model. Due to the C_comp differences between the DQ model and the
DQ_ODT* models, the output characteristics of the models will look different
when simulated. So, to match most closely with the HSPICE model, simulate with
the DQ_FULL or DQ_HALF model for ALL Output simulations. Use the ODT models
ONLY for Input simulations.
All the speed grades are combined into a single IBIS file
Use the models labeled with 533 for the DDR2-400/533 speeds and the models
labeled with 800 for the DDR2-667/800 speeds.
u49a.ibs Packaged model for commercial temperatures
u49a_bd.ibs Bare Die model
u49a_it.ibs Packaged model for industrial temperatures
[Disclaimer] This software code and all associated documentation, comments
or other information (collectively "Software") is provided
"AS IS" without warranty of any kind. MICRON TECHNOLOGY, INC.
("MTI") EXPRESSLY DISCLAIMS ALL WARRANTIES EXPRESS OR IMPLIED,
INCLUDING BUT NOT LIMITED TO, NONINFRINGEMENT OF THIRD PARTY
RIGHTS, AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR ANY PARTICULAR PURPOSE. MTI DOES NOT WARRANT THAT THE
SOFTWARE WILL MEET YOUR REQUIREMENTS, OR THAT THE OPERATION OF
THE SOFTWARE WILL BE UNINTERRUPTED OR ERROR-FREE. FURTHERMORE,
MTI DOES NOT MAKE ANY REPRESENTATIONS REGARDING THE USE OR THE
RESULTS OF THE USE OF THE SOFTWARE IN TERMS OF ITS CORRECTNESS,
ACCURACY, RELIABILITY, OR OTHERWISE. THE ENTIRE RISK ARISING OUT
OF USE OR PERFORMANCE OF THE SOFTWARE REMAINS WITH YOU. IN NO
EVENT SHALL MTI, ITS AFFILIATED COMPANIES OR THEIR SUPPLIERS BE
LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, INCIDENTAL, OR
SPECIAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS
OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION)
ARISING OUT OF YOUR USE OF OR INABILITY TO USE THE SOFTWARE,
EVEN IF MTI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Because some jurisdictions prohibit the exclusion or limitation
of liability for consequential or incidental damages, the above
limitation may not apply to you.
Copyright 2006 Micron Technology, Inc. All rights reserved.

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|***************************************************************************
|T69M EBD Model for 152-Ball TI-OMAP PoP 14 x 14 x 0.9mm VFBGA
|Dual Die LP-DDR DRAM
|
|Part Number VDD/VDDQ Architecture Package
|----------- -------- ------------ -------
|MT46H128M32L2CA 1.8/1.8V 128Mb x32 152-Ball OMAP PoP
|
|***************************************************************************
|
[IBIS Ver] 4.0
[File name] t69m_152b_2dp.ebd
[File rev] 1.0
[Date] 02/15/2010
[Source] From SPICE model at Micron Technology, Inc.
Micron Technology, Inc.
8000 S. Federal Way
P.O. Box 6, M/S: 01-711
Boise, ID 83707-0006
For support send e-mail to modelsupport@micron.com
|
[Notes] Rev 1.0: 02/15/2010
- Initial revision of packaging ebd
|
Notes:
- U1, U2 are the LPDRAM bare die components
(MT46H64M32LFT69M_DS)defined in the IBIS file t69m.ibs
- Please choose the appropriate speed grade and drive
strength models from the bare die ibis components
- In order to perform simulation using this model,
*.ebd and *.ibs files must be in the same directory
|
[Disclaimer] This software code and all associated documentation, comments
or other information (collectively "Software") is provided
"AS IS" without warranty of any kind. MICRON TECHNOLOGY, INC.
("MTI") EXPRESSLY DISCLAIMS ALL WARRANTIES EXPRESS OR IMPLIED,
INCLUDING BUT NOT LIMITED TO, NONINFRINGEMENT OF THIRD PARTY
RIGHTS, AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR
FITNESS FOR ANY PARTICULAR PURPOSE. MTI DOES NOT WARRANT THAT
THE SOFTWARE WILL MEET YOUR REQUIREMENTS, OR THAT THE
OPERATION OF THE SOFTWARE WILL BE UNINTERRUPTED OR ERROR-FREE.
FURTHERMORE, MTI DOES NOT MAKE ANY REPRESENTATIONS REGARDING
THE USE OR THE RESULTS OF THE USE OF THE SOFTWARE IN TERMS OF
ITS CORRECTNESS, ACCURACY, RELIABILITY, OR OTHERWISE. THE
ENTIRE RISK ARISING OUT OF USE OR PERFORMANCE OF THE SOFTWARE
REMAINS WITH YOU. IN NO EVENT SHALL MTI, ITS AFFILIATED
COMPANIES OR THEIR SUPPLIERS BE LIABLE FOR ANY DIRECT,
INDIRECT, CONSEQUENTIAL, INCIDENTAL, OR SPECIAL DAMAGES
(INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS,
BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
YOUR USE OF OR INABILITY TO USE THE SOFTWARE, EVEN IF MTI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Because some
jurisdictions prohibit the exclusion or limitation of
liability for consequential or incidental damages, the above
limitation may not apply to you.
|
[Copyright] Copyright 2010 Micron Technology, Inc. All rights reserved.
|
|***************************************************************************
| Component MT46H128M32L2CA (168-Ball VFBGA 14 x 14 x 0.9mm TI-OMAP PoP)
|***************************************************************************
|
[Begin Board Description] MT46H128M32L2CA
[Manufacturer] Micron Technology, Inc.
|
[Number Of Pins] 152
|
[Pin List] signal_name
A1 NC
A2 NC
A3 POWER
A4 DM1
A5 DQ13
A6 DQ15
A7 GND
A8 DQ10
A9 DQ12
A10 DQ16
A11 DQ19
A12 CK
A13 GND
A14 DM2
A15 POWER
A16 DQ21
A17 DQ20
A18 DM3
A19 DQS3
A20 NC
A21 NC
B1 NC
B2 NC
B3 DQ6
B4 DQ7
B5 POWER
B6 DQ9
B7 DQ14
B8 DQS1
B9 DQ11
B10 DQ8
B11 DQ17
B12 DQ18
B13 CK#
B14 GND
B15 DQS2
B16 POWER
B17 DQ23
B18 DQ22
B19 DQ28
B20 NC
B21 NC
C1 GND
C2 DQS0
C20 DQ24
C21 DQ26
D1 DQ3
D2 DQ5
D20 DQ25
D21 DQ29
E1 DQ0
E2 DQ1
E20 DQ27
E21 DQ31
F1 GND
F2 POWER
F20 GND
F21 POWER
G1 DQ4
G2 DQ2
G20 A0
G21 DQ30
H1 DM0
H2 GND
H20 GND
H21 POWER
J1 POWER
J2 NC
J20 A2
J21 A3
K1 NC
K2 NC
K20 A1
K21 A9
L1 NC
L2 NC
L20 POWER
L21 GND
M1 NC
M2 GND
M20 A7
M21 A6
N1 NC
N2 NC
N20 A8
N21 A11
P1 NC
P2 NC
P20 GND
P21 POWER
R1 NC
R2 GND
R20 A5
R21 A12
T1 NC
T2 NC
T20 CS1#
T21 CS0#
U1 NC
U2 NC
U20 CAS#
U21 A4
V1 NC
V2 NC
V20 BA1
V21 RAS#
W1 NC
W2 NC
W20 GND
W21 POWER
Y1 NC
Y2 NC
Y3 NC
Y4 NC
Y5 NC
Y6 GND
Y7 NC
Y8 NC
Y9 NC
Y10 NC
Y11 GND
Y12 NC
Y13 CKE1
Y14 POWER
Y15 CKE0
Y16 A10
Y17 GND
Y18 WE#
Y19 GND
Y20 NC
Y21 NC
AA1 NC
AA2 NC
AA3 NC
AA4 NC
AA5 NC
AA6 NC
AA7 GND
AA8 NC
AA9 NC
AA10 NC
AA11 POWER
AA12 NC
AA13 GND
AA14 POWER
AA15 A13
AA16 GND
AA17 POWER
AA18 BA0
AA19 POWER
AA20 NC
AA21 NC
|
[Path Description] DM1
Pin A4
Len = 1 R = 0.306 L = 2.758E-09 C = 1.014E-12 / | substrate RLC
Fork
Len = 0.974 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.64
Endfork
Fork
Len = 1.101 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.64
Endfork
|
[Path Description] DQ13
Pin A5
Len = 1 R = 0.114 L = 1.200E-09 C = 6.448E-13 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.70
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.70
Endfork
|
[Path Description] DQ15
Pin A6
Len = 1 R = 0.104 L = 1.121E-09 C = 6.383E-13 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.68
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.68
Endfork
|
[Path Description] DQ10
Pin A8
Len = 1 R = 0.089 L = 1.084E-09 C = 6.037E-13 / | substrate RLC
Fork
Len = 0.933 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.75
Endfork
Fork
Len = 1.054 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.75
Endfork
|
[Path Description] DQ12
Pin A9
Len = 1 R = 0.138 L = 1.438E-09 C = 6.913E-13 / | substrate RLC
Fork
Len = 0.910 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.71
Endfork
Fork
Len = 1.028 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.71
Endfork
|
[Path Description] DQ16
Pin A10
Len = 1 R = 0.347 L = 3.699E-09 C = 9.902E-13 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.29
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.29
Endfork
|
[Path Description] DQ19
Pin A11
Len = 1 R = 0.324 L = 3.129E-09 C = 1.058E-12 / | substrate RLC
Fork
Len = 0.910 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.26
Endfork
Fork
Len = 1.028 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.26
Endfork
|
[Path Description] CK
Pin A12
Len = 1 R = 0.167 L = 1.456E-09 C = 7.051E-13 / | substrate RLC
Fork
Len = 0.908 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.51
Endfork
Fork
Len = 1.026 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.51
Endfork
|
[Path Description] DM2
Pin A14
Len = 1 R = 0.155 L = 1.228E-09 C = 7.461E-13 / | substrate RLC
Fork
Len = 0.978 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.33
Endfork
Fork
Len = 1.105 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.33
Endfork
|
[Path Description] DQ21
Pin A16
Len = 1 R = 0.161 L = 1.437E-09 C = 7.543E-13 / | substrate RLC
Fork
Len = 0.935 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.22
Endfork
Fork
Len = 1.056 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.22
Endfork
|
[Path Description] DQ20
Pin A17
Len = 1 R = 0.194 L = 1.877E-09 C = 8.174E-13 / | substrate RLC
Fork
Len = 0.926 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.23
Endfork
Fork
Len = 1.047 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.23
Endfork
|
[Path Description] DM3
Pin A18
Len = 1 R = 0.126 L = 1.392E-09 C = 6.675E-13 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.17
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.17
Endfork
|
[Path Description] DQS3
Pin A19
Len = 1 R = 0.151 L = 1.597E-09 C = 7.194E-13 / | substrate RLC
Fork
Len = 0.909 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.16
Endfork
Fork
Len = 1.027 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.16
Endfork
|
[Path Description] DQ6
Pin B3
Len = 1 R = 0.053 L = 7.519E-10 C = 6.312E-13 / | substrate RLC
Fork
Len = 1.001 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.83
Endfork
Fork
Len = 1.131 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.83
Endfork
|
[Path Description] DQ7
Pin B4
Len = 1 R = 0.084 L = 8.282E-10 C = 6.914E-13 / | substrate RLC
Fork
Len = 1.024 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.82
Endfork
Fork
Len = 1.157 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.82
Endfork
|
[Path Description] DQ9
Pin B6
Len = 1 R = 0.151 L = 1.507E-09 C = 7.826E-13 / | substrate RLC
Fork
Len = 0.943 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.76
Endfork
Fork
Len = 1.066 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.76
Endfork
|
[Path Description] DQ14
Pin B7
Len = 1 R = 0.088 L = 7.703E-10 C = 6.969E-13 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.69
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.69
Endfork
|
[Path Description] DQS1
Pin B8
Len = 1 R = 0.092 L = 9.912E-10 C = 6.654E-13 / | substrate RLC
Fork
Len = 0.959 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.65
Endfork
Fork
Len = 1.084 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.65
Endfork
|
[Path Description] DQ11
Pin B9
Len = 1 R = 0.119 L = 1.102E-09 C = 7.498E-13 / | substrate RLC
Fork
Len = 0.925 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.74
Endfork
Fork
Len = 1.045 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.74
Endfork
|
[Path Description] DQ8
Pin B10
Len = 1 R = 0.151 L = 1.422E-09 C = 9.170E-13 / | substrate RLC
Fork
Len = 0.955 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.77
Endfork
Fork
Len = 1.080 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.77
Endfork
|
[Path Description] DQ17
Pin B11
Len = 1 R = 0.277 L = 2.914E-09 C = 1.011E-12 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.28
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.28
Endfork
|
[Path Description] DQ18
Pin B12
Len = 1 R = 0.261 L = 2.607E-09 C = 1.056E-12 / | substrate RLC
Fork
Len = 0.908 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.27
Endfork
Fork
Len = 1.026 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.27
Endfork
|
[Path Description] CK#
Pin B13
Len = 1 R = 0.102 L = 9.755E-10 C = 6.733E-13 / | substrate RLC
Fork
Len = 0.910 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.52
Endfork
Fork
Len = 1.028 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.52
Endfork
|
[Path Description] DQS2
Pin B15
Len = 1 R = 0.112 L = 1.109E-09 C = 7.450E-13 / | substrate RLC
Fork
Len = 0.962 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.32
Endfork
Fork
Len = 1.087 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.32
Endfork
|
[Path Description] DQ23
Pin B17
Len = 1 R = 0.208 L = 2.107E-09 C = 1.005E-12 / | substrate RLC
Fork
Len = 0.958 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.20
Endfork
Fork
Len = 1.082 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.20
Endfork
|
[Path Description] DQ22
Pin B18
Len = 1 R = 0.238 L = 2.317E-09 C = 1.036E-12 / | substrate RLC
Fork
Len = 0.945 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.21
Endfork
Fork
Len = 1.068 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.21
Endfork
|
[Path Description] DQ28
Pin B19
Len = 1 R = 0.154 L = 1.497E-09 C = 8.683E-13 / | substrate RLC
Fork
Len = 0.951 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.9
Endfork
Fork
Len = 1.075 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.9
Endfork
|
[Path Description] DQS0
Pin C2
Len = 1 R = 0.169 L = 1.483E-09 C = 8.658E-13 / | substrate RLC
Fork
Len = 0.909 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.81
Endfork
Fork
Len = 1.027 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.81
Endfork
|
[Path Description] DQ24
Pin C20
Len = 1 R = 0.049 L = 7.269E-10 C = 5.639E-13 / | substrate RLC
Fork
Len = 1.019 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.15
Endfork
Fork
Len = 1.151 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.15
Endfork
|
[Path Description] DQ26
Pin C21
Len = 1 R = 0.167 L = 1.927E-09 C = 7.797E-13 / | substrate RLC
Fork
Len = 0.981 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.11
Endfork
Fork
Len = 1.109 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.11
Endfork
|
[Path Description] DQ3
Pin D1
Len = 1 R = 0.181 L = 1.680E-09 C = 8.262E-13 / | substrate RLC
Fork
Len = 0.953 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.88
Endfork
Fork
Len = 1.077 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.88
Endfork
|
[Path Description] DQ5
Pin D2
Len = 1 R = 0.109 L = 1.042E-09 C = 7.989E-13 / | substrate RLC
Fork
Len = 0.984 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.86
Endfork
Fork
Len = 1.112 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.86
Endfork
|
[Path Description] DQ25
Pin D20
Len = 1 R = 0.081 L = 7.820E-10 C = 7.353E-13 / | substrate RLC
Fork
Len = 0.997 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.14
Endfork
Fork
Len = 1.126 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.14
Endfork
|
[Path Description] DQ29
Pin D21
Len = 1 R = 0.192 L = 1.891E-09 C = 8.269E-13 / | substrate RLC
Fork
Len = 0.940 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.8
Endfork
Fork
Len = 1.062 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.8
Endfork
|
[Path Description] DQ0
Pin E1
Len = 1 R = 0.231 L = 2.181E-09 C = 9.233E-13 / | substrate RLC
Fork
Len = 0.913 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.93
Endfork
Fork
Len = 1.031 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.93
Endfork
|
[Path Description] DQ1
Pin E2
Len = 1 R = 0.163 L = 1.616E-09 C = 8.598E-13 / | substrate RLC
Fork
Len = 0.917 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.92
Endfork
Fork
Len = 1.037 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.92
Endfork
|
[Path Description] DQ27
Pin E20
Len = 1 R = 0.122 L = 1.206E-09 C = 8.238E-13 / | substrate RLC
Fork
Len = 0.965 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.10
Endfork
Fork
Len = 1.090 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.10
Endfork
|
[Path Description] DQ31
Pin E21
Len = 1 R = 0.224 L = 2.076E-09 C = 8.513E-13 / | substrate RLC
Fork
Len = 0.912 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.4
Endfork
Fork
Len = 1.030 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.4
Endfork
|
[Path Description] DQ4
Pin G1
Len = 1 R = 0.302 L = 2.823E-09 C = 1.062E-12 / | substrate RLC
Fork
Len = 0.968 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.87
Endfork
Fork
Len = 1.093 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.87
Endfork
|
[Path Description] DQ2
Pin G2
Len = 1 R = 0.185 L = 1.847E-09 C = 8.731E-13 / | substrate RLC
Fork
Len = 0.941 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.89
Endfork
Fork
Len = 1.064 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.89
Endfork
|
[Path Description] A0
Pin G20
Len = 1 R = 0.555 L = 6.025E-09 C = 1.680E-12 / | substrate RLC
Fork
Len = 0.892 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.112
Endfork
Fork
Len = 1.007 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.112
Endfork
|
[Path Description] DQ30
Pin G21
Len = 1 R = 0.233 L = 2.148E-09 C = 9.300E-13 / | substrate RLC
Fork
Len = 0.916 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.5
Endfork
Fork
Len = 1.035 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.5
Endfork
|
[Path Description] DM0
Pin H1
Len = 1 R = 0.352 L = 3.258E-09 C = 1.127E-12 / | substrate RLC
Fork
Len = 0.907 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.80
Endfork
Fork
Len = 1.025 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.80
Endfork
|
[Path Description] A2
Pin J20
Len = 1 R = 0.507 L = 5.618E-09 C = 1.577E-12 / | substrate RLC
Fork
Len = 0.902 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.110
Endfork
Fork
Len = 1.020 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.110
Endfork
|
[Path Description] A3
Pin J21
Len = 1 R = 0.541 L = 5.916E-09 C = 1.482E-12 / | substrate RLC
Fork
Len = 0.944 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.109
Endfork
Fork
Len = 1.066 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.109
Endfork
|
[Path Description] A1
Pin K20
Len = 1 R = 0.465 L = 5.335E-09 C = 1.499E-12 / | substrate RLC
Fork
Len = 0.901 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.111
Endfork
Fork
Len = 1.018 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.111
Endfork
|
[Path Description] A9
Pin K21
Len = 1 R = 0.689 L = 6.531E-09 C = 1.839E-12 / | substrate RLC
Fork
Len = 0.884 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.127
Endfork
Fork
Len = 0.999 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.127
Endfork
|
[Path Description] A7
Pin M20
Len = 1 R = 0.652 L = 7.575E-09 C = 1.828E-12 / | substrate RLC
Fork
Len = 0.885 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.129
Endfork
Fork
Len = 1.000 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.129
Endfork
|
[Path Description] A6
Pin M21
Len = 1 R = 0.761 L = 8.535E-09 C = 1.926E-12 / | substrate RLC
Fork
Len = 0.890 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.130
Endfork
Fork
Len = 1.006 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.130
Endfork
|
[Path Description] A8
Pin N20
Len = 1 R = 0.599 L = 6.720E-09 C = 1.758E-12 / | substrate RLC
Fork
Len = 0.885 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.128
Endfork
Fork
Len = 1.000 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.128
Endfork
|
[Path Description] A11
Pin N21
Len = 1 R = 0.640 L = 6.498E-09 C = 1.717E-12 / | substrate RLC
Fork
Len = 0.884 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.126
Endfork
Fork
Len = 0.999 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.126
Endfork
|
[Path Description] A5
Pin R20
Len = 1 R = 0.593 L = 6.813E-09 C = 1.665E-12 / | substrate RLC
Fork
Len = 0.891 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.131
Endfork
Fork
Len = 1.007 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.131
Endfork
|
[Path Description] A12
Pin R21
Len = 1 R = 0.596 L = 5.935E-09 C = 1.581E-12 / | substrate RLC
Fork
Len = 0.897 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.125
Endfork
Fork
Len = 1.013 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.125
Endfork
|
[Path Description] CS1#
Pin T20
Len = 1 R = 0.299 L = 3.100E-09 C = 1.233E-12 / | substrate RLC
Fork
Len = 0.999 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.116
Endfork
|
[Path Description] CS0#
Pin T21
Len = 1 R = 0.378 L = 4.671E-09 C = 1.122E-12 / | substrate RLC
Fork
Len = 0.884 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.116
Endfork
|
[Path Description] CAS#
Pin U20
Len = 1 R = 0.404 L = 4.908E-09 C = 1.345E-12 / | substrate RLC
Fork
Len = 0.891 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.118
Endfork
Fork
Len = 1.007 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.118
Endfork
|
[Path Description] A4
Pin U21
Len = 1 R = 0.655 L = 7.029E-09 C = 1.702E-12 / | substrate RLC
Fork
Len = 0.927 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.132
Endfork
Fork
Len = 1.047 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.132
Endfork
|
[Path Description] BA1
Pin V20
Len = 1 R = 0.344 L = 4.098E-09 C = 1.217E-12 / | substrate RLC
Fork
Len = 0.885 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.115
Endfork
Fork
Len = 1.000 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.115
Endfork
|
[Path Description] RAS#
Pin V21
Len = 1 R = 0.433 L = 5.218E-09 C = 1.263E-12 / | substrate RLC
Fork
Len = 0.910 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.117
Endfork
Fork
Len = 1.028 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.117
Endfork
|
[Path Description] CKE1
Pin Y13
Len = 1 R = 0.275 L = 2.854E-09 C = 1.135E-12 / | substrate RLC
Fork
Len = 1.000 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.120
Endfork
|
[Path Description] CKE0
Pin Y15
Len = 1 R = 0.381 L = 4.197E-09 C = 1.283E-12 / | substrate RLC
Fork
Len = 0.885 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.120
Endfork
|
[Path Description] A10
Pin Y16
Len = 1 R = 0.215 L = 2.046E-09 C = 9.507E-13 / | substrate RLC
Fork
Len = 0.891 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.113
Endfork
Fork
Len = 1.007 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.113
Endfork
|
[Path Description] WE#
Pin Y18
Len = 1 R = 0.516 L = 5.732E-09 C = 1.556E-12 / | substrate RLC
Fork
Len = 0.890 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.119
Endfork
Fork
Len = 1.006 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.119
Endfork
|
[Path Description] A13
Pin AA15
Len = 1 R = 0.518 L = 5.600E-09 C = 1.418E-12 / | substrate RLC
Fork
Len = 0.896 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.124
Endfork
Fork
Len = 1.013 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.124
Endfork
|
[Path Description] BA0
Pin AA18
Len = 1 R = 0.428 L = 4.305E-09 C = 1.245E-12 / | substrate RLC
Fork
Len = 0.886 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U1.114
Endfork
Fork
Len = 1.001 R = 0.07764 L = 4.22e-10 C = 6.05e-14 / | bondwire RLC
Node U2.114
Endfork
|
[Reference Designator Map]
|
| Ref Des File name Component name
U1 t69m.ibs MT46H64M32LFT69M_DS
U2 t69m.ibs MT46H64M32LFT69M_DS
[End Board Description]
|
[End]

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T69M IBIS Model
Die Rev "A"
2Gb Mobile LPDDR SDRAM
Rev 2.0: 02/15/2010
t69m.ibs is applicable to Commercial temperature range (0C to 70C)
t69m_it.ibs is applicable to Industrial temperature range (-40C to 85C)
t69m_at.ibs is applicable to Automotive temperature range (-40C to 105C)
NOTES
-----
Please see t69m.ibs and appropriate package EBD file for Notes
and Revision History.
For bare die and single die packages use t69m.ibs file. For dual
and quad die PoP package use .ebd file and t69m.ibs file.
Part Number VDD/VDDQ Architecture Package EBD Model
----------- -------- ------------ ------- ---------
MT46H128M16LFCK 1.8/1.8V 128 Meg x 16 60-Ball VFBGA 10x11.5mm None
MT46H64M32LFCM 1.8/1.8V 64 Meg x 32 90-Ball VFBGA 10x13mm None
MT46H64M32LFMA 1.8/1.8V 64 Meg x 32 168-Ball OMAP PoP 12x12mm None
MT46H64M32LFMB 1.8/1.8V 64 Meg x 32 152-Ball OMAP PoP 14x14mm None
MT46H128M16LFT69M_DS 1.8/1.8V 128 Meg x 16 Bare Die (Dual-Sided) None
MT46H64M32LFT69M_DS 1.8/1.8V 64 Meg x 32 Bare Die (Dual-Sided) None
MT46H128M16LFT69M_SS 1.8/1.8V 128 Meg x 16 Bare Die (Single-Sided) None
MT46H64M32LFT69M_SS 1.8/1.8V 64 Meg x 32 Bare Die (Single-Sided) None
MT46H128M32L2CA 1.8/1.8V 128Mb x 32 152-Ball OMAP PoP DDP t69m_152b_2dp.ebd
MT46H256M32L4KZ 1.8/1.8V 256Mb x 32 152-Ball OMAP PoP QDP t69m_152b_4dp.ebd
MT46H128M32L2KQ 1.8/1.8V 128Meg x 32 168-Ball OMAP PoP DDP t69m_168b_2dp.ebd
MT46H256M32L4JV 1.8/1.8V 256Meg x32 168-Ball OMAP PoP QDP t69m_168b_4dp.ebd
MT46H128M32L2MC 1.8/1.8V 128Mb x32 240-Ball QCT PoP DDP t69m_240b_2dp.ebd
MT46HC128M16LFCK 1.8/1.2V 128 Meg x 16 60-Ball VFBGA 10x11.5mm None
MT46HC64M32LFCM 1.8/1.2V 64 Meg x 32 90-Ball VFBGA 10x13mm None
MT46HC128M16LFT69M_DS 1.8/1.2V 128 Meg x 16 Bare Die (Dual-Sided) None
MT46HC64M32LFT69M_DS 1.8/1.2V 64 Meg x 32 Bare Die (Dual-Sided) None
MT46HC128M16LFT69M_SS 1.8/1.2V 128 Meg x 16 Bare Die (Single-Sided) None
MT46HC64M32LFT69M_SS 1.8/1.2V 64 Meg x 32 Bare Die (Single-Sided) None

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