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ben-wpan/atusb/README-PCB

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Board characteristics:
- stacking: 2 layers, solder mask on front and back, silk screen on front
- board material: FR4, thickness 0.8 mm (1/32"), 1 oz copper
- surface finish: TBD, ENIG is preferred
- via holes: diameter is nominally 10 mil, but any size <= 15 mil can be used
- mechanical tolerances: <= +/- 0.1 mm on all sides
Layer stacking, from top to bottom:
atusb-SilkS_Front.gto Front silk screen
atusb-Mask_Front.gts Front solder mask
atusb-Front.gtl Front copper
atusb-Back.gbl Back copper
atusb-Mask_Back.gbs Back solder mask (empty)
Other design files:
atusb-PCB_Edges.gbr Board edges, for routing (Gerber)
atusb.dxf idem (AutoCAD DXF)
atusb.drl Excellon drill file
Interpretation of files:
- for all coordinates, the origin is the lower left corner of the board
- do not print component values on silk screen
- the center (!) of the board edge line marks the true board edge, e.g.,
Edge line (5 mil)
=======
------- - - - - - ----------
| |
PCB outside | | PCB inside
| |
------- - - - - - ----------
|
Volume removed when cutting
(width depends on tool used)