mirror of
git://projects.qi-hardware.com/ben-wpan.git
synced 2024-11-26 11:50:36 +02:00
atusb: added fab file generation, like in atben
- Makefile (VERSION, DIR): added board version and parent directory name - Makefile: added generation of Gerbers and other fab files - Makefile (gen): this never worked, changed --plot to --plot=ps - Makefile: added section titles - README-PCB: PCB making instructions
This commit is contained in:
parent
6bbe3bfcf9
commit
cdf3825d24
@ -1,15 +1,18 @@
|
|||||||
PLOT_BRD = pcbnew --plot=ps_a4 --ps-pads-drill-opt=none --fill-all-zones
|
PLOT_BRD = pcbnew --plot=ps_a4 --ps-pads-drill-opt=none --fill-all-zones
|
||||||
|
|
||||||
NAME = atusb
|
NAME = atusb
|
||||||
|
VERSION = 110214
|
||||||
|
DIR = $(NAME)
|
||||||
|
|
||||||
.PHONY: all gen generate sch brd xpdf front back clean
|
.PHONY: all gen generate sch brd xpdf front back clean
|
||||||
|
.PHONY: gerber gerbv fab
|
||||||
|
|
||||||
all:
|
all:
|
||||||
@echo "make what ? target: gen sch brd xpdf front back clean"
|
@echo "make what ? target: gen sch brd xpdf front back clean"
|
||||||
@exit 1
|
@exit 1
|
||||||
|
|
||||||
gen generate:
|
gen generate:
|
||||||
eeschema --plot `pwd`/$(NAME).sch
|
eeschema --plot=ps `pwd`/$(NAME).sch
|
||||||
# need scripts
|
# need scripts
|
||||||
|
|
||||||
sch:
|
sch:
|
||||||
@ -27,6 +30,8 @@ front: $(NAME)-Front.ps
|
|||||||
back: $(NAME)-Back.ps
|
back: $(NAME)-Back.ps
|
||||||
lpr $<
|
lpr $<
|
||||||
|
|
||||||
|
# --- DIY production (toner transfer) -----------------------------------------
|
||||||
|
|
||||||
#
|
#
|
||||||
# Postscript for production of front/back layer, using the toner transfer
|
# Postscript for production of front/back layer, using the toner transfer
|
||||||
# method. Note that other artwork transfer methods may require different
|
# method. Note that other artwork transfer methods may require different
|
||||||
@ -44,9 +49,39 @@ back: $(NAME)-Back.ps
|
|||||||
%-Back.ps: %.brd
|
%-Back.ps: %.brd
|
||||||
$(PLOT_BRD) -l Back $<
|
$(PLOT_BRD) -l Back $<
|
||||||
|
|
||||||
|
# --- Industrial production ---------------------------------------------------
|
||||||
|
|
||||||
|
PCB_FILES = README-PCB $(NAME)-PCB_Edges.dxf $(NAME).drl \
|
||||||
|
$(NAME)-SilkS_Front.gto $(NAME)-Mask_Front.gts \
|
||||||
|
$(NAME)-Front.gtl $(NAME)-Back.gbl $(NAME)-Mask_Back.gbs \
|
||||||
|
$(NAME)-PCB_Edges.gbr
|
||||||
|
|
||||||
|
gerber:
|
||||||
|
pcbnew --plot=gerber \
|
||||||
|
-l `pcbnew --list-layers $(NAME).brd | tr '\012' ,` \
|
||||||
|
--fill-all-zones $(NAME).brd \
|
||||||
|
--exclude-pcb-edge
|
||||||
|
|
||||||
|
fab: gerber
|
||||||
|
pcbnew --plot=dxf -l PCB_Edges $(NAME).brd
|
||||||
|
pcbnew --drill $(NAME).brd
|
||||||
|
tar Ccfz .. $(NAME)-$(VERSION).tar.gz $(PCB_FILES:%=$(DIR)/%)
|
||||||
|
cd ..; zip -l $(DIR)/$(NAME)-$(VERSION).zip \
|
||||||
|
$(PCB_FILES:%=$(DIR)/%)
|
||||||
|
|
||||||
|
gerbv:
|
||||||
|
gerbv $(NAME)-Comments.gbr \
|
||||||
|
$(NAME)-SilkS_Front.gto \
|
||||||
|
$(NAME)-SoldP_Front.gtp \
|
||||||
|
$(NAME)-Front.gtl \
|
||||||
|
$(NAME)-Mask_Front.gts \
|
||||||
|
$(NAME)-Back.gbl
|
||||||
|
|
||||||
|
# --- Cleanup -----------------------------------------------------------------
|
||||||
|
|
||||||
clean:
|
clean:
|
||||||
rm -f $(NAME)-Front.ps $(NAME)-Back.ps
|
rm -f $(NAME)-Front.ps $(NAME)-Back.ps
|
||||||
rm -f $(NAME).drl $(NAME)-PCB_Edges.gbr
|
rm -f $(NAME).drl $(NAME)-PCB_Edges.gbr $(NAME)-PCB_Edges.dxf
|
||||||
rm -f $(NAME)-Front.gtl $(NAME)-Mask_Front.gts
|
rm -f $(NAME)-Front.gtl $(NAME)-Mask_Front.gts
|
||||||
rm -f $(NAME)-SilkS_Front.gto $(NAME)-SoldP_Front.gtp
|
rm -f $(NAME)-SilkS_Front.gto $(NAME)-SoldP_Front.gtp
|
||||||
rm -f $(NAME)-Back.gbl $(NAME)-Mask_Back.gbs
|
rm -f $(NAME)-Back.gbl $(NAME)-Mask_Back.gbs
|
||||||
|
38
atusb/README-PCB
Normal file
38
atusb/README-PCB
Normal file
@ -0,0 +1,38 @@
|
|||||||
|
Board characteristics:
|
||||||
|
|
||||||
|
- stacking: 2 layers, solder mask on front and back, silk screen on front
|
||||||
|
- board material: FR4, thickness 0.8 mm, 1 oz copper
|
||||||
|
- surface finish: TBD, both ENIG and tin are acceptable
|
||||||
|
- via holes: diameter is nominally 10 mil, but any size <= 15 mil can be used
|
||||||
|
- mechanical tolerances: <= +/- 0.1 mm on all sides
|
||||||
|
|
||||||
|
Layer stacking, from top to bottom:
|
||||||
|
|
||||||
|
atusb-SilkS_Front.gto Front silk screen
|
||||||
|
atusb-Mask_Front.gts Front solder mask
|
||||||
|
atusb-Front.gtl Front copper
|
||||||
|
atusb-Back.gbl Back copper
|
||||||
|
atusb-Mask_Back.gbs Back solder mask (empty)
|
||||||
|
|
||||||
|
Other design files:
|
||||||
|
|
||||||
|
atusb-PCB_Edges.gbr Board edges, for routing (Gerber)
|
||||||
|
atusb.dxf idem (AutoCAD DXF)
|
||||||
|
atusb.drl Excellon drill file
|
||||||
|
|
||||||
|
Interpretation of files:
|
||||||
|
|
||||||
|
- do not print PCB edges on front/back copper
|
||||||
|
- do not print component values on silk screen
|
||||||
|
- the center (!) of the board edge line marks the true board edge, e.g.,
|
||||||
|
|
||||||
|
Edge line (5 mil)
|
||||||
|
=======
|
||||||
|
------- - - - - - ----------
|
||||||
|
| |
|
||||||
|
PCB outside | | PCB inside
|
||||||
|
| |
|
||||||
|
------- - - - - - ----------
|
||||||
|
|
|
||||||
|
Volume removed when cutting
|
||||||
|
(width depends on tool used)
|
Loading…
Reference in New Issue
Block a user