kicad-libs/modules/INFO

#
# Tags:
#
# F     Footprint name (must be first)
# N     Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
#

# Printed 8:10 card contacs
F: 8_10-card

# Open clip for AA batteries, through-hole
# http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf
# Note: should generalize this for AAA and maybe also larger sizes
F: bat-clip-aa-th

# BGA
F: bga
# - 484-Pin FineLine BGA(FBGA), from Altera
#   http://www.altera.com/devicepackaging/04R00416-02.pdf
#
# - FG(G)484 Fine-Pitch BGA, from Xilinx
#   http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
#

# Chip SMD Aluminum Electrolytic Capacitors
F: c-smd
#
#   for example 10TZV220M6.3X8 from RUBYCON
#
# - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm
#
#   package drawing 
#   http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf
#
#   land pattern
#   http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf
#

# Chip SMD Tantalum Capacitors
F: c-t-smd
#
#   for example T520B157M006ATE070 from KEMET
#   
# - TC-$Case-$EIA-$Density
#   the density is based on the conditions outlined in IPC standard 7351 (IPC-7351).
#
#   package drawing ( page 62 ), land pattern ( page 73 ) 
#   http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/KEM_TC102_LOWESR.pdf/$file/KEM_TC102_LOWESR.pdf
#

# DO-214
F: do-214
#
# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
#   http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
#
# - DO-214AB(SMC), from Fairchild
#   http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
#
# - DO-214AC(SMA), from Fairchild
#   http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
#

# EUS (R-PDSS-T6)
F: eus
#
# - for example: the PTH04000WAH data sheet, it's EUS
#   http://www.ti.com/lit/ds/symlink/pth04000w.pdf
# 

# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
F: fiducial

# IR Receiver Module
F: ir
#
# From Vishay:
#
# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
#   http://www.vishay.com/docs/81732/tsop348.pdf

# LED right angle package
F: ledsmd
#
# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
#   http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
#   added a letter 'R' stands for right angle land pattern
#   could expand it as else land pattern for 0603, 0805, 0805R, etc.
#	

# MDIP
F: mdip
#
# From FAIRCHILD:
#
# - the 6N138S data sheet
#   http://www.fairchildsemi.com/ds/6N/6N138.pdf
#
# Package Type:
#
# - MDIP 8L
#   http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
#
# Package Drawing:
#
#   http://www.fairchildsemi.com/dwg/N0/N08H.pdf

# Mini-USB B receptable (SMT; almost generic)
F: mini_usb_b

# Solder pads and test points
F: pads

# "pads" in typical array formations
F: pads-array

# "Generic" simple QFN
F: qfn
#
# The information for these packages comes from various sources:
#
# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
#   http://www.nxp.com/package/SOT617-1.html
#   http://www.nxp.com/package/SOT617-3.html
#
# Solder paste:
#
# Footprint    Center pad  Closest NXP (with complete land pattern)
# QFN28-Atmel  2.4 mm	   for further study
# QFN28-SiLabs 3.3 mm	   use SiLab's specification
# QFN32-VHHD-2 3.7 mm	   between SOT818-1 and SOT788-1
# QFN32-VHHD-6 3.4 mm	   SOT818-1
#
# From NXP:
#
# Package   Pad  Paste zone  Islands  Isl. size  Isl. gap
# SiLabs    3.25 3.1	     3 x 3    0.9	 
# SOT818-1  3.4  1.75	     2 x 2    0.75	 0.25
# SOT788-1  4.0  2.4	     3 x 3    0.6	 0.3
#
# NXP rules (AN10365):
# - paste zone = 35% of pad area
# - paste coverge = 20% of pad area
#
# Our parameters:
#
# Package       Pad  Paste zone  Islands  Isl. size  Isl. gap  Zone  Coverage
# QFN32-VHHD-2  3.7  2.15	 3 x 3	  0.55	     0.25      34%   20%
# QFN32-VHHD-6  3.4  1.95	 2 x 2	  0.75	     0.45      33%   19%
#
# Known bugs:
#
# - really ought to merge all the various QFN definitions (we have more
#   over at gta02-core) into a single QFN file with a big mean table of
#   everything
#
N: sot617-3-lp

# "Generic" simple QFP (for now, just for Silabs' C8051F320)
F: qfp
#
# - the C8051F320 data sheet
#   http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
# 
# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
# the LQPF48/TQFP48 referred to the same package drawing and land pattern
#
# - LQFP48, TQFP48: C48 -> package drawing
#   http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
#	
# - LQFP48, TQFP48: C48 -> package land pattern
#   http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
#  
# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
#   http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf 
#	
# - LQFP64, C64 -> package drawing
#   http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
#	
# - LQFP64, C64 -> package land pattern
#   http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
#  

# 3.5mm audio stereo phone jack
F: phonejack
# 
# phonejack-${size}-${N}
# From SCPRE:
#
# - phonejack-3.5-5, the SCJ368R1NUS0B00G data sheet, drawing
#   http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Audio/SCJ368R1NUS0B00G.pdf
#

# SOIC
F: soic
#
# From TI:
#
# - the SN75HVD12DR data sheet
#   http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
#
# Package Drawing:
#
# - D(JEDEC)
#   - R-PDSO-G8
#   http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
#   - R-PDSO-G14
#   http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
#   - R-PDSO-G16
#   http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf

# SOT generic package
F: sot
# experimental generic SOT footprint; currently only for
#
# - SOT-323 aka SC-70
#   http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
# - SOT-363 aka SC-88 aka SC-70-6
#   http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
# - SOT-523
#   http://www.diodes.com/datasheets/ds31784.pdf
# - SOT-563
#   http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
#
# some conflicts with the outline exist

# SOT23 generic package with counter-clockweise or clockwise pin assignment
F: sot23
#
# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
#   http://www.diodes.com/datasheets/APX803.pdf
#
#   for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
#   http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
#

# Standard rectangular passive components
F: stdpass
#
# packages: 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512
# polarized(marked the cathode) packages: starts from 0603P to 2512P
#
# be noticed that 1812 land pattern based on a p/n: miniSMDC200F from Tycoelectronics
# http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Catalog+Section%7FSURFACE-MOUNT%7FA1%7Fpdf%7FEnglish%7FENG_CS_SURFACE-MOUNT_A1.pdf%7FRF1410-000
# 

# SOT-323 package with counter-clockweise or clockwise pin assignment
F: sot-323
N: mmst3904

# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
# http://www.nxp.com/packages/SOT341-1.html
# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf

# "Generic" simple SSOP
F: ssop
#
# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
#   http://www.micrel.com/_PDF/mic2550a.pdf
#	
# - TSSOP14: from NXP -> package land pattern
#   http://www.nxp.com/packages/SOT402-1.html
#   http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf

# "Generic" simple TO-252, TO-263
F: to
#
# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
#   http://www.ti.com/lit/ds/symlink/lp38690.pdf
# 
# - JEDEC Spec: TO-252 AA  -> package drawing and land pattern
#   http://www.national.com/packaging/mkt/td03b.pdf
#	
# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
#   http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
# 
# - JEDEC Spec: TO-263 THIN  -> package drawing and land pattern
#   http://www.national.com/packaging/mkt/tj5a.pdf
#	

# "Generic" simple TSOP
F: tsop
#
# - TSOP28: Z28 -> package drawing
#   http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
#	
# - TSOP28: Z28 -> package land pattern
#   http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
#  
# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
# the TSOP32 referred to the same package drawing and land pattern
#
# - TSOP32: Z32 -> package drawing
#   http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
#	
# - TSOP32: Z32 -> package land pattern
#   http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
#  
# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
#   http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
#
# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
#   http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf 
#	
# - TSOP66: currently referred to M1rc3 design files land pattern:
#   width of pad  -> 0.4 mm, it's rectangle not round one
#   length of pad -> 1.25 mm
#   Width of body -> 400 mil

# TSSOP5 for NXP
F: tssop5
#
# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet, 
#   http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
#   http://www.nxp.com/packages/SOT353-1.html
#   but without real land pattern found, still could refer link below for more in details:
#   http://www.nxp.com/documents/application_note/AN10365.pdf	
#
#   also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
#   they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
#
#   NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
#   could use a land pattern of pad length to be 0.7 mm.
#

# USB A plug for SMT
#
# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
# 0.1 mm with respect to the reference.
#
# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
# 3.5 mm.
#
# Assuming that the pad is intended to extend a bit beyond the lead, we need
# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
# be intended to be used this way, however, we still have to consider small
# errors in registration, which also amount to about 0.1 mm, so the calculation
# remains valid.)
#
F: usb_a_plug_smt

# USB 2.0 from usb_20_040908, page 99
F: usb-a-pcb

# 2-pins rectangular smd xtal
F: xtal-2
#
# - xtal2-11.5mmx4.83mm package drawing, land pattern
#   for example R49SSA-028636-F20-YYY-YQA
#   http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf
#

# 4-pins rectangular smd xtal
F: xtal-4
#
# - xtal4-3.2mmx2.5mm package drawing, land pattern
#   for example NX3225SA
#   http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf
#
# - xtal4-5mmx3.2mm package drawing, land pattern
#   for example SO5032-050000-O3A-BBE-QA
#   http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf
#
# - xtal4-6mmx3.6mm package drawing, land pattern
#   for example ABMM2-24.576MHZ-E2-T
#   http://www.abracon.com/Resonators/ABMM2.pdf
#