.. |
8_10-card.fpd
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8_10-card.fpd: set pad type to "bare", so the we don't get solder paste on them
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2011-01-17 22:14:25 -03:00 |
8_10-socket-ra.fpd
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8_10-socket-ra.fpd: added 8:10-SOCKET-RA
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2012-06-14 20:41:07 +08:00 |
bat-clip-aa-th.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
bga.fpd
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bga.fpd: added module for Altera 484-FineLine BGA(FBGA) and Xilinx FG(G)484 Fine-Pitch BGA, 1.00 mm pitch
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2012-06-05 14:27:02 +08:00 |
c-smd.fpd
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c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors
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2012-06-07 20:26:59 +08:00 |
c-t-smd.fpd
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c-t-smd.fpd: added variants named: TC-$Case-$EIA-$Density for relevant EIA size of Tantalum capacitors
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2012-06-08 13:28:55 +08:00 |
dcjack.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
DESCR
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modules/{Makefile, DESCR}: include descriptions in catalog
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2012-07-12 18:55:40 -03:00 |
din-5.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
dip4of6.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
do-214.fpd
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do-214.fpd: added DO-214AA package
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2012-06-06 15:57:00 +08:00 |
dvi-recept-ra.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
eus.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
fiducial.fpd
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modules/INFO, modules/Makefile, modules/fiducial.fpd, AUTHORS: added fiducial
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2011-03-23 12:33:40 -03:00 |
he-2row-dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
he-shrouded.fpd
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he-shrouded.fpd: added NPTH frame
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2012-06-12 19:10:20 +08:00 |
header.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
HIERARCHY
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modules/: add ZX62M-B-BP (zx62m-b-5p.fpd) to catalog and Makefile
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2012-07-14 22:46:59 -03:00 |
INFO
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modules/: add measurementes to DIP-4/6-300mil; add to catalog and Makefile
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2012-07-14 22:37:19 -03:00 |
ir.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
ledsmd.fpd
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ledsmd.fpd: fixed polarized marker
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2012-06-18 18:01:17 +08:00 |
Makefile
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modules/: add ZX62M-B-BP (zx62m-b-5p.fpd) to catalog and Makefile
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2012-07-14 22:46:59 -03:00 |
mdip.fpd
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mdip.fpd: 1) set mil unit 2) added measurements 3) set width = 355 mil
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2012-05-23 17:28:22 +08:00 |
meander-2450MHz.fpd
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modules/meander-2450MHz.fpd: do not try to add a tail if zero-sized
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2012-07-12 16:16:01 -03:00 |
mic-ra-dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
mini-usb.fpd
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Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming)
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2011-08-14 03:06:15 -03:00 |
pads-array.fpd
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modules/pads-array.fpd: added measurements; enabled more pads types
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2012-07-13 23:01:03 -03:00 |
pads.fpd
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pads.fpd: added variant sets of C(circle), R(oround) and S(square) pads.
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2012-06-19 14:27:19 +08:00 |
phonejack.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
qfn.fpd
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modules/qfn.fpd: add experimental footprint for AD CP-16-5a* MQ_LFCSP_LQ
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2012-06-10 11:56:26 -03:00 |
qfp-gen.fpd
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modules/qfp-gen.fpd: further improvements (WIP)
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2012-05-29 21:52:30 -03:00 |
qfp.fpd
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qfp.fpd: added QFP64 variant
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2012-06-04 16:46:19 +08:00 |
rca-3-ra.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
rj45.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
soic.fpd
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added SOIC footprints: 8, 14 and 16 pins.
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2012-05-28 13:53:41 +08:00 |
sot23.fpd
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sot23.fpd: added measurement for max. distance between pads.
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2012-06-06 11:05:40 +08:00 |
sot-323.fpd
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Moved sot-323.fpd from ben-wpan to kicad-libs (incoming)
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2011-08-14 04:49:36 -03:00 |
sot.fpd
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modules/sot.fpd: put width measurement at constant distance from pad
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2012-07-13 23:29:56 -03:00 |
spacer.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
ssop.fpd
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ssop.fpd: added TSSOP14 variant and move marker placed at outside of left lower corner.
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2012-06-04 15:51:29 +08:00 |
stdpass.fpd
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stdpass.fpd: added 1812 size which referred from TycoElectronics
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2012-06-08 15:49:53 +08:00 |
tactile-sw-spst-ra-dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
to.fpd
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modules/to.fpd (TO-252): remove zero-width pad 2
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2012-07-12 04:36:51 -03:00 |
tsop.fpd
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tsop.fpd: changed measurements and moved marker to be close to pin1's left side.
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2012-06-05 22:19:26 +08:00 |
tssop5.fpd
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modules/tssop5.fpd: remove zero-width pad 5
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2012-07-12 04:38:38 -03:00 |
usb_a_plug_smt.fpd
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Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming)
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2011-08-14 03:06:15 -03:00 |
usb-a-dual-recept-r.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
usb-a-pcb.fpd
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modules/usb-a-pcb.fpd: change pad type from "normal" to "bare"
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2012-07-18 23:41:26 -03:00 |
xlr-plug.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
xlr-socket.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
xtal-2.fpd
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xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm
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2012-06-07 13:42:15 +08:00 |
xtal-4.fpd
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xtal-4.fpd: added xtal4-5mmx3.2mm variant package
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2012-06-07 14:37:28 +08:00 |
zx62m-b-5p.fpd
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modules/zx62m-b-5p.fpd: Hirose ZX62M-B-5P Micro-USB receptacle (mid-mount)
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2012-04-01 20:12:02 -03:00 |