mirror of
git://projects.qi-hardware.com/kicad-libs.git
synced 2024-12-27 10:26:48 +02:00
220 lines
6.1 KiB
Plaintext
220 lines
6.1 KiB
Plaintext
#
|
|
# Tags:
|
|
#
|
|
# F Footprint name (must be first)
|
|
# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
|
|
#
|
|
|
|
# Printed 8:10 card contacs
|
|
F: 8_10-card
|
|
|
|
# EUS (R-PDSS-T6)
|
|
F: eus
|
|
#
|
|
# - for example: the PTH04000WAH data sheet, it's EUS
|
|
# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
|
|
#
|
|
|
|
# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
|
|
F: fiducial
|
|
|
|
# IR Receiver Module
|
|
F: ir
|
|
#
|
|
# From Vishay:
|
|
#
|
|
# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
|
|
# http://www.vishay.com/docs/81732/tsop348.pdf
|
|
|
|
# MDIP
|
|
F: mdip
|
|
#
|
|
# From FAIRCHILD:
|
|
#
|
|
# - the 6N138S data sheet
|
|
# http://www.fairchildsemi.com/ds/6N/6N138.pdf
|
|
#
|
|
# Package Type:
|
|
#
|
|
# - MDIP 8L
|
|
# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
|
|
#
|
|
# Package Drawing:
|
|
#
|
|
# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
|
|
|
|
# Mini-USB B receptable (SMT; almost generic)
|
|
F: mini_usb_b
|
|
|
|
# Solder pads and test points
|
|
F: pads
|
|
|
|
# "Generic" simple QFN
|
|
F: qfn
|
|
#
|
|
# The information for these packages comes from various sources:
|
|
#
|
|
# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
|
|
# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
|
|
# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
|
|
# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
|
|
# http://www.nxp.com/package/SOT617-1.html
|
|
# http://www.nxp.com/package/SOT617-3.html
|
|
#
|
|
# Solder paste:
|
|
#
|
|
# Footprint Center pad Closest NXP (with complete land pattern)
|
|
# QFN28-Atmel 2.4 mm for further study
|
|
# QFN28-SiLabs 3.3 mm use SiLab's specification
|
|
# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
|
|
# QFN32-VHHD-6 3.4 mm SOT818-1
|
|
#
|
|
# From NXP:
|
|
#
|
|
# Package Pad Paste zone Islands Isl. size Isl. gap
|
|
# SiLabs 3.25 3.1 3 x 3 0.9
|
|
# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
|
|
# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
|
|
#
|
|
# NXP rules (AN10365):
|
|
# - paste zone = 35% of pad area
|
|
# - paste coverge = 20% of pad area
|
|
#
|
|
# Our parameters:
|
|
#
|
|
# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
|
|
# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
|
|
# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
|
|
#
|
|
# Known bugs:
|
|
#
|
|
# - really ought to merge all the various QFN definitions (we have more
|
|
# over at gta02-core) into a single QFN file with a big mean table of
|
|
# everything
|
|
#
|
|
N: sot617-3-lp
|
|
|
|
# "Generic" simple QFP (for now, just for Silabs' C8051F320)
|
|
F: qfp
|
|
#
|
|
# - the C8051F320 data sheet
|
|
# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
|
|
#
|
|
# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
|
|
# the LQPF48/TQFP48 referred to the same package drawing and land pattern
|
|
#
|
|
# - LQFP48, TQFP48: C48 -> package drawing
|
|
# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
|
|
#
|
|
# - LQFP48, TQFP48: C48 -> package land pattern
|
|
# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
|
|
#
|
|
|
|
# SOIC
|
|
F: soic
|
|
#
|
|
# From TI:
|
|
#
|
|
# - the SN75HVD12DR data sheet
|
|
# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
|
|
#
|
|
# Package Drawing:
|
|
#
|
|
# - D(JEDEC)
|
|
# - R-PDSO-G8
|
|
# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
|
|
# - R-PDSO-G14
|
|
# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
|
|
# - R-PDSO-G16
|
|
# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
|
|
|
|
F: sot
|
|
|
|
# Standard rectangular passive components
|
|
F: stdpass
|
|
|
|
# SOT-323 package with counter-clockweise or clockwise pin assignment
|
|
F: sot-323
|
|
N: mmst3904
|
|
|
|
# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
|
|
# http://www.nxp.com/packages/SOT341-1.html
|
|
# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
|
|
F: ssop
|
|
|
|
# experimental generic SOT footprint; currently only for
|
|
#
|
|
# - SOT-323 aka SC-70
|
|
# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
|
|
# - SOT-363 aka SC-88 aka SC-70-6
|
|
# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
|
|
# - SOT-523
|
|
# http://www.diodes.com/datasheets/ds31784.pdf
|
|
# - SOT-563
|
|
# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
|
|
#
|
|
# some conflicts with the outline exist
|
|
|
|
# "Generic" simple TSOP
|
|
F: tsop
|
|
#
|
|
# - the JS28F256J3F105 data sheet, it's TSOP-56
|
|
# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
|
|
#
|
|
# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
|
|
# the TSOP32 referred to the same package drawing and land pattern
|
|
#
|
|
# - TSOP28: Z28 -> package drawing
|
|
# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
|
|
#
|
|
# - TSOP28: Z28 -> package land pattern
|
|
# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
|
|
#
|
|
#
|
|
# - TSOP32: Z32 -> package drawing
|
|
# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
|
|
#
|
|
# - TSOP32: Z32 -> package land pattern
|
|
# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
|
|
#
|
|
|
|
# "Generic" simple TO-252, TO-263
|
|
F: to
|
|
#
|
|
# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
|
|
# http://www.ti.com/lit/ds/symlink/lp38690.pdf
|
|
#
|
|
# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
|
|
# http://www.national.com/packaging/mkt/td03b.pdf
|
|
#
|
|
# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
|
|
# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
|
|
#
|
|
# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
|
|
# http://www.national.com/packaging/mkt/tj5a.pdf
|
|
#
|
|
|
|
# USB A plug for SMT
|
|
#
|
|
# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
|
|
# 0.1 mm with respect to the reference.
|
|
#
|
|
# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
|
|
# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
|
|
# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
|
|
# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
|
|
# 3.5 mm.
|
|
#
|
|
# Assuming that the pad is intended to extend a bit beyond the lead, we need
|
|
# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
|
|
# be intended to be used this way, however, we still have to consider small
|
|
# errors in registration, which also amount to about 0.1 mm, so the calculation
|
|
# remains valid.)
|
|
#
|
|
F: usb_a_plug_smt
|
|
|
|
# USB 2.0 from usb_20_040908, page 99
|
|
F: usb-a-pcb
|
|
|
|
|