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pkgology/1g-dyadic: package overview of dyadic 1G packages (based on 74xxx1G08)

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Werner Almesberger 2011-07-24 06:45:42 -03:00
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Some SMT packages used for 74xxx1G devices (5-6 contacts)
Package name Width x Depth Lead to Lead Pitch Leads/Pkg
TI DBV 1.45|1.75x2.75|3.05 2.6|3.00 0.95 5
TI DCK 1.10|1.40x1.85|2.25 1.8|2.40 0.65 5
NXP GW/SOT353-1 1.15|1.35x1.85|2.25 2.0|2.25 0.65 5
TI DRL 1.50|1.70x1.10|1.30 1.50|1.70 0.50 5
TI DRY 0.95|1.05x1.40|1.50 0.50 6 NL
NXP GM/SOT886 0.95|1.05x1.40|1.50 0.50 6 NL
TI DSF 0.95|1.05x0.95|1.05 0.35 6 NL
NXP GF/SOT891 0.95|1.05x0.95|1.05 0.35 6 NL
NXP GS/SOT1115 0.85|0.95x0.85|0.95 0.55 6 NL
NXP GN/SOT1202 0.95|1.05x0.95|1.05 0.55 6 NL
TI YZP 0.85|0.95x1.35|1.45 0.50 5 BGA
TI YFP 0.74|0.80x1.14|1.20 0.40 6 BGA
Pkg: NL = no lead (contacts may be accessible with a narrow probe)
BGA = contacts inaccessible
Sources:
http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
http://focus.ti.com/lit/ds/symlink/sn74aup1g08.pdf