- atben.sch, atben.cmp, atben.brd: CLKM test point would have been
inaccessible - reduced its size and moved it closer to the transceiver
- atben.brd: made board 0.2 mm longer to create room to disentangle
analog power and crystal
- atben.brd: moved upper left VDD via to allow chamfered corner to be
larger
- atben.brd: moved DVDD via further away from the board edge
- atben.brd: straightened AVDD trace
- atben.pro: commit noise
- atben.brd: increased separation between VDD and SLP_TR via in upper left
corner
- atben.brd: rearranged ground zone around above vias
- atben.brd: separated ground zones for RF and analog power
- atben.brd: made antenna ground wrap around contact
- atben.sch: removed C9 (only exists in Jonhanson's reference design;
neither Atmel not Wuerth have it; in experiments, no effect was
observed)
- atben.brd: rotated the transceiver by 90 degrees and redid layout
- atben.brd: aligned 8:10 card shape and antenna to metric (0.1 mm) grid
and adjusted outline accordingly
- atben.sch, atben.brd: version is now 20110215
- atben.brd: make traces inside 8:10 card slot go straight as long as
possible, to avoid shorts with exposed contacts
- atben.brd: removed "IEEE 802.15.4" and "CC-BY-SA" from copper layer
- atben.brd: reduced date code to two-digit year
- atben.brd: bumped version to 20110207
- atben.brd: updated 0805-6 footprint of the balun and rearranged its
surroundings accordingly
- atben.brd: rearranged boundary between RF and power ground zones
- atben.brd: moved vias "south" of the balun by 5 mil
- atben.brd: moved component references C10, C11, and X1 such that
they're not convered by comment lines
- atben.brd: broke up comment line "east" of X1 to avoid overlap with C10
and C11 pads
- atben.brd: shifted author's name to make crossing lines coincide with
vertical strokes in letters
Settings according to
http://www.nxp.com/documents/mounting_and_soldering/AN10365.pdf
- atben.pro, atben.brd, atusb.pro, atusb.brd: set solder mask clearance
to 50 um (copper-defined pads)
- atben.pro, atben.brd, atusb.pro, atusb.brd: set solder paste clearance
to 25 um
- atben.brd: moved component references for proper printing on silk screen
- atben.brd: moved component values for easy display (do not print on
silk screen !)
- atben.brd: removed unused back silk screen and back solder paste layer
- atben.pro (LibName5) : use ../../kicad-libs/modules/8_10-card instead of
../../kicad-libs/modules/usd-card
- atben.sch: use footprint "8:10-card" instead of "uSD-Card"
- atben.cmp, atben.brd: updated for renaming of usd-card.fpd
- atben/TODO: changed all occurrences of "atusd" to "atben"
- atben/TODO: added reminder that the file isn't current anymore
- atben/Makefile (NAME): changed project name from "atusd" to "atben"
- atben/atusd.brd: renamed to atben/atben.brd
- atben/atusd.cmp: renamed to atben/atben.cmp
- atben/atusd.pro: renamed to atben/atben.pro
- atben/atusd.sch: renamed to atben/atben.sch
