2010-10-25 05:41:51 +03:00
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#
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# Tags:
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#
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# F Footprint name (must be first)
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# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
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#
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2011-01-17 17:12:49 +02:00
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# Printed 8:10 card contacs
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F: 8_10-card
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2011-03-23 17:33:40 +02:00
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2012-06-07 05:33:19 +03:00
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# Open clip for AA batteries, through-hole
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# http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf
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# Note: should generalize this for AAA and maybe also larger sizes
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F: bat-clip-aa-th
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2012-06-14 15:41:07 +03:00
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# 8:10 Card Socket Connectors RIGHT ANGLE SMT Hinge Type
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F: 8_10-socket-ra
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#
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# - 8:10-SOCKET-RA, package drawing, land pattern
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# for example MOLEX 500901-0801
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# http://www.molex.com/pdm_docs/sd/5009010801_sd.pdf
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#
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2012-06-05 09:27:02 +03:00
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# BGA
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F: bga
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# - 484-Pin FineLine BGA(FBGA), from Altera
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# http://www.altera.com/devicepackaging/04R00416-02.pdf
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#
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# - FG(G)484 Fine-Pitch BGA, from Xilinx
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# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
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#
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2012-06-07 15:26:59 +03:00
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# Chip SMD Aluminum Electrolytic Capacitors
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F: c-smd
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#
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# for example 10TZV220M6.3X8 from RUBYCON
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#
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# - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm
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#
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# package drawing
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# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf
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#
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# land pattern
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# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf
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#
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2012-06-08 08:28:55 +03:00
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# Chip SMD Tantalum Capacitors
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F: c-t-smd
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#
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# for example T520B157M006ATE070 from KEMET
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#
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# - TC-$Case-$EIA-$Density
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# the density is based on the conditions outlined in IPC standard 7351 (IPC-7351).
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#
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# package drawing ( page 62 ), land pattern ( page 73 )
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# http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/KEM_TC102_LOWESR.pdf/$file/KEM_TC102_LOWESR.pdf
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#
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2012-06-13 10:51:49 +03:00
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# SOCKET, PCB, DC POWER JACK
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F: dcjack
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#
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# - DCJACK-${L}x${W}, package drawing, land pattern
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# for example SCPRE SCD441CPS011B00G
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# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Supply/SCD441CPS011B00G.pdf
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#
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2012-06-13 09:18:39 +03:00
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# SOCKET, DIN, PCB, 180, 5PIN, 5WAYS, 45 DEGREE
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F: din-5
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#
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# - DIN-SOCKET-PCB-5-45, package drawing, land pattern
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# for example DELTRON 671-0500
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# http://www.farnell.com/datasheets/65433.pdf
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#
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2012-06-06 09:30:56 +03:00
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# DO-214
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F: do-214
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#
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# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
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# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
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#
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# - DO-214AB(SMC), from Fairchild
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# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
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#
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2012-06-06 10:57:00 +03:00
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# - DO-214AC(SMA), from Fairchild
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2012-06-06 09:30:56 +03:00
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# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
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#
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2012-06-14 08:45:47 +03:00
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# CONN RECEPT ANALOG DIGITAL DVI RIGHT ANGLE
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F: dvi-recept-ra
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#
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# - DVI-RECEPT-RA, package drawing, land pattern
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# for example MOLEX 74320-1004
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# http://www.molex.com/pdm_docs/sd/743201004_sd.pdf
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#
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2012-05-30 07:05:25 +03:00
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# EUS (R-PDSS-T6)
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F: eus
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#
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# - for example: the PTH04000WAH data sheet, it's EUS
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# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
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#
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2011-03-23 17:33:40 +02:00
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# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
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F: fiducial
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2011-08-14 06:26:32 +03:00
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2012-06-15 05:18:09 +03:00
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# 2 rows of Header with outline for through hole type
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F: he-2row-dip
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#
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# - HE-${n}x2-${px}: for example FCI: the 87606-310LF data sheet, package drawing
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# http://portal.fciconnect.com/res/en/pdffiles/doc_search/87606.pdf
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#
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2012-06-19 06:23:53 +03:00
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# generic header through hole type
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F: header
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#
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# - HDR-${C}x${R}-$P
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# C --> column number
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# R --> row number
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# P --> pitch
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#
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2012-06-12 11:34:53 +03:00
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# Header with outline for shrouded wafer for example, SMD type
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F: he-shrouded
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#
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2012-06-12 14:10:20 +03:00
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# - he-shrouded-${n}x2pins-${pitch}: for example Molex: the 87832-1420 data sheet, package drawing
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2012-06-12 11:34:53 +03:00
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# http://www.molex.com/pdm_docs/sd/878321420_sd.pdf
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#
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2012-05-30 07:05:25 +03:00
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# IR Receiver Module
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F: ir
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#
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# From Vishay:
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#
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# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
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# http://www.vishay.com/docs/81732/tsop348.pdf
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2012-06-06 11:59:41 +03:00
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# LED right angle package
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F: ledsmd
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#
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# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
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# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
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# added a letter 'R' stands for right angle land pattern
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# could expand it as else land pattern for 0603, 0805, 0805R, etc.
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#
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2012-05-30 07:05:25 +03:00
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# MDIP
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F: mdip
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#
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# From FAIRCHILD:
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#
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# - the 6N138S data sheet
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# http://www.fairchildsemi.com/ds/6N/6N138.pdf
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#
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# Package Type:
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#
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# - MDIP 8L
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# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
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#
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# Package Drawing:
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#
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# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
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2012-06-13 05:19:26 +03:00
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# Small Size 2.4 GHz PCB Antenna
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# http://focus.ti.com/lit/an/swra117d/swra117d.pdf
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F: meander-2.4GHz
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2012-06-15 06:13:44 +03:00
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# Microphone, through hole type, bent pins
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F: mic-ra-dip
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#
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# - MIC-RA-DIP-${Dia}x${Height}: for example PRO SIGNAL the MP33125 data sheet, package drawing
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# http://www.farnell.com/datasheets/359234.pdf
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# be noted that placements of two pins based on bending pins to suitable right angle purpose.
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# the py# is the option to change to distance that you want.
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#
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2012-05-30 07:05:25 +03:00
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# Mini-USB B receptable (SMT; almost generic)
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F: mini_usb_b
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# Solder pads and test points
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F: pads
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2012-06-19 09:27:19 +03:00
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#
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# - PAD_${type}_$size
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# type --> C: circle, R: round, S: square
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# size --> dimension
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#
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2012-05-30 07:05:25 +03:00
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2012-06-10 02:09:36 +03:00
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# "pads" in typical array formations
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F: pads-array
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2011-08-14 06:26:32 +03:00
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# "Generic" simple QFN
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F: qfn
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#
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# The information for these packages comes from various sources:
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#
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# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
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# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
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# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
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# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
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# http://www.nxp.com/package/SOT617-1.html
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# http://www.nxp.com/package/SOT617-3.html
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#
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# Solder paste:
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#
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# Footprint Center pad Closest NXP (with complete land pattern)
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# QFN28-Atmel 2.4 mm for further study
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# QFN28-SiLabs 3.3 mm use SiLab's specification
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# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
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# QFN32-VHHD-6 3.4 mm SOT818-1
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#
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# From NXP:
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#
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# Package Pad Paste zone Islands Isl. size Isl. gap
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# SiLabs 3.25 3.1 3 x 3 0.9
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# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
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# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
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#
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# NXP rules (AN10365):
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# - paste zone = 35% of pad area
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# - paste coverge = 20% of pad area
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#
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# Our parameters:
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#
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# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
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# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
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# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
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#
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# Known bugs:
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#
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# - really ought to merge all the various QFN definitions (we have more
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# over at gta02-core) into a single QFN file with a big mean table of
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# everything
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#
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N: sot617-3-lp
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# "Generic" simple QFP (for now, just for Silabs' C8051F320)
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F: qfp
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2012-05-25 13:19:04 +03:00
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#
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# - the C8051F320 data sheet
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# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
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#
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# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
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# the LQPF48/TQFP48 referred to the same package drawing and land pattern
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#
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2012-06-25 10:50:01 +03:00
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# - LQFP48, TQFP48: C48 -> ackage drawping
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2012-05-25 13:19:04 +03:00
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# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
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#
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# - LQFP48, TQFP48: C48 -> package land pattern
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# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
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#
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2012-06-04 11:46:19 +03:00
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# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
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# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
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#
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# - LQFP64, C64 -> package drawing
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# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
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#
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# - LQFP64, C64 -> package land pattern
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# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
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#
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2012-06-25 10:50:01 +03:00
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# comparisons of pads dimension of WM9707, KS8001, ADV7125
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#
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# MIN NOM MAX chip
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# "b" 0.17mm 0.22mm 0.27mm WM9707
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# 0.19mm 0.22mm 0.25mm KS8001
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# 0.17mm 0.22mm 0.27mm ADV7125
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# "L" 0.45mm 0.6mm 0.75mm WM9707
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# 0.5mm 0.6mm 0.7mm KS8001
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# 0.45mm 0.6mm 0.75mm ADV7125
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#
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# so a combination of both ackage drawping and land pattern from Maxim
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# the lad pattern for QFP48 is 0.27mm for "b", 1.45mm for "L"
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# it should be safe.
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#
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2011-08-14 09:06:15 +03:00
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2012-06-11 05:26:51 +03:00
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# 3.5mm audio stereo phone jack
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2012-06-11 07:00:03 +03:00
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F: phonejack
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#
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# phonejack-${size}-${N}
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# From SCPRE:
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2012-06-11 05:26:51 +03:00
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#
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2012-06-11 07:00:03 +03:00
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# - phonejack-3.5-5, the SCJ368R1NUS0B00G data sheet, drawing
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2012-06-11 05:26:51 +03:00
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# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Audio/SCJ368R1NUS0B00G.pdf
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#
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2012-06-14 11:54:55 +03:00
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|
|
# CONN RCA JACK 3-CONs RIGHT ANGLE
|
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|
F: rca-3-ra
|
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|
#
|
|
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|
|
# - RCA-3-RA, package drawing, land pattern
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|
|
# for example SCPRE SCP662CNS257U00G
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|
|
|
# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/SCP662CNS257U00G.pdf
|
|
|
|
|
#
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|
2012-06-11 15:19:02 +03:00
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|
# RJ45, 8 pins, two leds
|
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|
F: rj45
|
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|
#
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|
|
# - RJ45-8-LED, the 48025-0002 data sheet, drawing, from MOLEX
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|
# http://www.molex.com/pdm_docs/sd/480250002_sd.pdf
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|
#
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|
2012-05-30 07:05:25 +03:00
|
|
|
# SOIC
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F: soic
|
2011-08-14 09:06:15 +03:00
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|
#
|
2012-05-30 07:05:25 +03:00
|
|
|
# From TI:
|
2011-08-14 09:06:15 +03:00
|
|
|
#
|
2012-05-30 07:05:25 +03:00
|
|
|
# - the SN75HVD12DR data sheet
|
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|
|
# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
|
2011-08-14 09:06:15 +03:00
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|
|
#
|
2012-05-30 07:05:25 +03:00
|
|
|
# Package Drawing:
|
2011-08-14 09:06:15 +03:00
|
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|
#
|
2012-05-30 07:05:25 +03:00
|
|
|
# - D(JEDEC)
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|
|
# - R-PDSO-G8
|
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|
# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
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|
# - R-PDSO-G14
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|
# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
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|
|
# - R-PDSO-G16
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|
# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
|
2011-08-14 10:02:18 +03:00
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|
2012-06-05 17:25:20 +03:00
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|
# SOT generic package
|
2012-05-30 07:05:25 +03:00
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|
F: sot
|
2012-06-05 17:25:20 +03:00
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|
# experimental generic SOT footprint; currently only for
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|
#
|
2012-06-19 05:43:54 +03:00
|
|
|
# - SOT-235, for example, TI SOT-23, DBV(R-PDSO-G5) package
|
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|
|
# http://www.ti.com/lit/ds/symlink/tps76301.pdf
|
2012-06-05 17:25:20 +03:00
|
|
|
# - SOT-323 aka SC-70
|
|
|
|
|
# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
|
|
|
|
|
# - SOT-363 aka SC-88 aka SC-70-6
|
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|
|
# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
|
|
|
|
|
# - SOT-523
|
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|
|
# http://www.diodes.com/datasheets/ds31784.pdf
|
|
|
|
|
# - SOT-563
|
|
|
|
|
# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
|
|
|
|
|
#
|
|
|
|
|
# some conflicts with the outline exist
|
2012-05-30 07:05:25 +03:00
|
|
|
|
2012-06-05 11:26:17 +03:00
|
|
|
# SOT23 generic package with counter-clockweise or clockwise pin assignment
|
|
|
|
|
F: sot23
|
|
|
|
|
#
|
2012-06-06 06:25:19 +03:00
|
|
|
# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
|
2012-06-05 11:26:17 +03:00
|
|
|
# http://www.diodes.com/datasheets/APX803.pdf
|
2012-06-06 06:25:19 +03:00
|
|
|
#
|
|
|
|
|
# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
|
|
|
|
|
# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
|
|
|
|
|
#
|
2012-06-05 11:26:17 +03:00
|
|
|
|
2012-05-30 07:05:25 +03:00
|
|
|
# Standard rectangular passive components
|
|
|
|
|
F: stdpass
|
2012-06-07 04:08:32 +03:00
|
|
|
#
|
2012-06-08 10:49:53 +03:00
|
|
|
# packages: 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512
|
2012-06-07 04:08:32 +03:00
|
|
|
# polarized(marked the cathode) packages: starts from 0603P to 2512P
|
|
|
|
|
#
|
2012-06-08 10:49:53 +03:00
|
|
|
# be noticed that 1812 land pattern based on a p/n: miniSMDC200F from Tycoelectronics
|
|
|
|
|
# http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Catalog+Section%7FSURFACE-MOUNT%7FA1%7Fpdf%7FEnglish%7FENG_CS_SURFACE-MOUNT_A1.pdf%7FRF1410-000
|
|
|
|
|
#
|
2011-08-14 10:49:36 +03:00
|
|
|
|
|
|
|
|
# SOT-323 package with counter-clockweise or clockwise pin assignment
|
|
|
|
|
F: sot-323
|
|
|
|
|
N: mmst3904
|
2011-08-16 03:09:44 +03:00
|
|
|
|
|
|
|
|
# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
|
2012-05-25 00:52:27 +03:00
|
|
|
# http://www.nxp.com/packages/SOT341-1.html
|
|
|
|
|
# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
|
2011-08-16 21:58:26 +03:00
|
|
|
|
2012-06-15 13:06:52 +03:00
|
|
|
# mechanical mounting holes
|
|
|
|
|
F: spacer
|
|
|
|
|
#
|
|
|
|
|
# - SPACER-$nominal-$disc-$keepout$type
|
|
|
|
|
# nominal --> hole dia.
|
|
|
|
|
# disc --> copper dia.
|
|
|
|
|
# keepout --> keepout dia.
|
|
|
|
|
# type --> "-BARE" : no copper area
|
|
|
|
|
# --> "" : with copper area
|
|
|
|
|
#
|
|
|
|
|
|
2012-06-04 10:51:29 +03:00
|
|
|
# "Generic" simple SSOP
|
|
|
|
|
F: ssop
|
|
|
|
|
#
|
|
|
|
|
# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
|
|
|
|
|
# http://www.micrel.com/_PDF/mic2550a.pdf
|
|
|
|
|
#
|
|
|
|
|
# - TSSOP14: from NXP -> package land pattern
|
|
|
|
|
# http://www.nxp.com/packages/SOT402-1.html
|
|
|
|
|
# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
|
|
|
|
|
|
2012-06-15 11:46:46 +03:00
|
|
|
# SWITCH, TACTILE, SPST, R/A, THROUGH HOLE
|
|
|
|
|
F: tactile-sw-spst-ra-dip.fpd
|
|
|
|
|
#
|
|
|
|
|
# - TACTIL-SW-${TYPE}-RA-${A}-${B}, package drawing, land pattern
|
|
|
|
|
# for example TYCO ELECTRONICS FSMRA2JH
|
|
|
|
|
# http://www.farnell.com/datasheets/51343.pdf
|
|
|
|
|
#
|
|
|
|
|
|
2012-06-05 17:25:20 +03:00
|
|
|
# "Generic" simple TO-252, TO-263
|
|
|
|
|
F: to
|
2012-05-29 05:34:38 +03:00
|
|
|
#
|
2012-06-05 17:25:20 +03:00
|
|
|
# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
|
|
|
|
|
# http://www.ti.com/lit/ds/symlink/lp38690.pdf
|
2012-05-29 05:34:38 +03:00
|
|
|
#
|
2012-06-05 17:25:20 +03:00
|
|
|
# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
|
|
|
|
|
# http://www.national.com/packaging/mkt/td03b.pdf
|
|
|
|
|
#
|
|
|
|
|
# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
|
|
|
|
|
# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
|
|
|
|
|
#
|
|
|
|
|
# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
|
|
|
|
|
# http://www.national.com/packaging/mkt/tj5a.pdf
|
|
|
|
|
#
|
|
|
|
|
|
|
|
|
|
# "Generic" simple TSOP
|
|
|
|
|
F: tsop
|
2012-05-29 05:34:38 +03:00
|
|
|
#
|
2012-05-29 06:54:41 +03:00
|
|
|
# - TSOP28: Z28 -> package drawing
|
|
|
|
|
# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
|
|
|
|
|
#
|
|
|
|
|
# - TSOP28: Z28 -> package land pattern
|
|
|
|
|
# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
|
|
|
|
|
#
|
2012-06-05 17:25:20 +03:00
|
|
|
# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
|
|
|
|
|
# the TSOP32 referred to the same package drawing and land pattern
|
2012-05-29 06:54:41 +03:00
|
|
|
#
|
2012-05-29 05:34:38 +03:00
|
|
|
# - TSOP32: Z32 -> package drawing
|
|
|
|
|
# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
|
|
|
|
|
#
|
|
|
|
|
# - TSOP32: Z32 -> package land pattern
|
|
|
|
|
# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
|
|
|
|
|
#
|
2012-06-05 17:25:20 +03:00
|
|
|
# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
|
|
|
|
|
# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
|
2012-06-04 09:13:17 +03:00
|
|
|
#
|
|
|
|
|
# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
|
|
|
|
|
# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
|
|
|
|
|
#
|
|
|
|
|
# - TSOP66: currently referred to M1rc3 design files land pattern:
|
|
|
|
|
# width of pad -> 0.4 mm, it's rectangle not round one
|
|
|
|
|
# length of pad -> 1.25 mm
|
|
|
|
|
# Width of body -> 400 mil
|
2012-05-29 05:34:38 +03:00
|
|
|
|
2012-06-06 05:32:33 +03:00
|
|
|
# TSSOP5 for NXP
|
|
|
|
|
F: tssop5
|
2012-06-05 17:25:20 +03:00
|
|
|
#
|
2012-06-06 05:32:33 +03:00
|
|
|
# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
|
2012-06-05 17:25:20 +03:00
|
|
|
# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
|
|
|
|
|
# http://www.nxp.com/packages/SOT353-1.html
|
|
|
|
|
# but without real land pattern found, still could refer link below for more in details:
|
|
|
|
|
# http://www.nxp.com/documents/application_note/AN10365.pdf
|
2012-06-06 05:32:33 +03:00
|
|
|
#
|
|
|
|
|
# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
|
|
|
|
|
# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
|
|
|
|
|
#
|
|
|
|
|
# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
|
|
|
|
|
# could use a land pattern of pad length to be 0.7 mm.
|
|
|
|
|
#
|
2012-05-29 05:34:38 +03:00
|
|
|
|
2012-06-13 16:20:10 +03:00
|
|
|
# USB DUAL STACKED A RECEPT CON R/A
|
|
|
|
|
# F: usb-a-dual-recept-r
|
|
|
|
|
#
|
|
|
|
|
# - USB-A-DUAL-RECEPT-RA, package drawing, land pattern
|
|
|
|
|
# for example MOLEX 67298-4090
|
|
|
|
|
# http://www.molex.com/pdm_docs/sd/672984090_sd.pdf
|
|
|
|
|
#
|
|
|
|
|
|
2012-05-30 07:05:25 +03:00
|
|
|
# USB A plug for SMT
|
|
|
|
|
#
|
|
|
|
|
# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
|
|
|
|
|
# 0.1 mm with respect to the reference.
|
|
|
|
|
#
|
|
|
|
|
# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
|
|
|
|
|
# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
|
|
|
|
|
# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
|
|
|
|
|
# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
|
|
|
|
|
# 3.5 mm.
|
|
|
|
|
#
|
|
|
|
|
# Assuming that the pad is intended to extend a bit beyond the lead, we need
|
|
|
|
|
# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
|
|
|
|
|
# be intended to be used this way, however, we still have to consider small
|
|
|
|
|
# errors in registration, which also amount to about 0.1 mm, so the calculation
|
|
|
|
|
# remains valid.)
|
|
|
|
|
#
|
|
|
|
|
F: usb_a_plug_smt
|
|
|
|
|
|
|
|
|
|
# USB 2.0 from usb_20_040908, page 99
|
|
|
|
|
F: usb-a-pcb
|
|
|
|
|
|
2012-06-13 05:19:26 +03:00
|
|
|
# XLR, SOCKET, PANEL, HORIZ/PCB
|
|
|
|
|
F: xlr-socket
|
|
|
|
|
#
|
|
|
|
|
# - XLR-PANEL-HORIZ/PCB-SOCKET, package drawing, land pattern
|
|
|
|
|
# for example NEUTRIK NC3FAH1
|
|
|
|
|
# http://www.neutrik.us/en-us/xlr/a-series/nc3fah1
|
|
|
|
|
#
|
|
|
|
|
|
2012-06-13 06:21:13 +03:00
|
|
|
# XLR, PLUG, PANEL, HORIZ/PCB
|
|
|
|
|
F: xlr-plug
|
|
|
|
|
#
|
|
|
|
|
# - XLR-PANEL-HORIZ/PCB-PLUG, package drawing, land pattern
|
|
|
|
|
# for example NEUTRIK NC3MAH
|
|
|
|
|
# http://www.neutrik.us/en-us/xlr/a-series/nc3mah
|
|
|
|
|
#
|
|
|
|
|
|
2012-06-07 08:42:15 +03:00
|
|
|
# 2-pins rectangular smd xtal
|
|
|
|
|
F: xtal-2
|
|
|
|
|
#
|
|
|
|
|
# - xtal2-11.5mmx4.83mm package drawing, land pattern
|
|
|
|
|
# for example R49SSA-028636-F20-YYY-YQA
|
|
|
|
|
# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf
|
|
|
|
|
#
|
|
|
|
|
|
2012-06-07 05:33:19 +03:00
|
|
|
# 4-pins rectangular smd xtal
|
|
|
|
|
F: xtal-4
|
|
|
|
|
#
|
2012-06-07 08:42:15 +03:00
|
|
|
# - xtal4-3.2mmx2.5mm package drawing, land pattern
|
2012-06-07 05:33:19 +03:00
|
|
|
# for example NX3225SA
|
|
|
|
|
# http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf
|
|
|
|
|
#
|
2012-06-07 09:37:28 +03:00
|
|
|
# - xtal4-5mmx3.2mm package drawing, land pattern
|
|
|
|
|
# for example SO5032-050000-O3A-BBE-QA
|
|
|
|
|
# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf
|
|
|
|
|
#
|
2012-06-07 08:42:15 +03:00
|
|
|
# - xtal4-6mmx3.6mm package drawing, land pattern
|
2012-06-07 05:33:19 +03:00
|
|
|
# for example ABMM2-24.576MHZ-E2-T
|
|
|
|
|
# http://www.abracon.com/Resonators/ABMM2.pdf
|
|
|
|
|
#
|
|
|
|
|
|
2012-06-13 05:19:26 +03:00
|
|
|
|
