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8_10-card.fpd
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8_10-card.fpd: set pad type to "bare", so the we don't get solder paste on them
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2011-01-17 22:14:25 -03:00 |
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8_10-socket-ra-push-pull.fpd
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modules/8_10-socket-ra-push-pull.fpd: Amphenol 114-00841-68 push-pull uSD
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2012-12-22 22:01:06 -03:00 |
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8_10-socket-ra.fpd
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8_10-socket-ra.fpd: added 8:10-SOCKET-RA
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2012-06-14 20:41:07 +08:00 |
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bat-clip-aa-th.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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bga.fpd
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bga: use the nominal size
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2012-12-21 22:32:53 +08:00 |
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c-smd.fpd
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c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors
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2012-06-07 20:26:59 +08:00 |
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c-t-smd.fpd
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c-t-smd.fpd: added variants named: TC-$Case-$EIA-$Density for relevant EIA size of Tantalum capacitors
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2012-06-08 13:28:55 +08:00 |
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dcjack.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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DESCR
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modules/usb_a_rcpt_mid.fpd: correct 48258 drill hole; make pin pads oval
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2014-01-05 15:30:48 -03:00 |
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dfn.fpd
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modules/dfn.fpd: DFN-8 (aka TI's WSON-8) package, for TPS6216x
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2012-12-21 20:22:17 -03:00 |
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din-5.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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dip4of6.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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do-214.fpd
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do-214.fpd: added DO-214AA package
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2012-06-06 15:57:00 +08:00 |
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dvi-recept-ra.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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e-switch320.fpd
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modules/: add E-SWITCH series 320 tact switch
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2012-08-22 16:34:32 -03:00 |
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er-oled-fpc30.fpd
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modules/er-oled-fpc30.fpd: make pads 0.06 mm wider, 0.1 mm longer
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2013-09-20 15:01:29 -03:00 |
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eus.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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evqq7.fpd
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add Panasonic EVQQ7 "joystick" switch
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2012-11-05 17:47:12 -03:00 |
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fiducial.fpd
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modules/INFO, modules/Makefile, modules/fiducial.fpd, AUTHORS: added fiducial
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2011-03-23 12:33:40 -03:00 |
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he-2row-dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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he-shrouded.fpd
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he-shrouded.fpd: added NPTH frame
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2012-06-12 19:10:20 +08:00 |
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header.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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HIERARCHY
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modules/usb_a_rcpt_mid.fpd: Molex 48258-0002/0001, TE 1746311
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2014-01-05 12:09:57 -03:00 |
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inductor-2p.fpd
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modules/inductor-2p.fpd: footprints for 2-SMD inductors (3mmx3mm for now)
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2012-12-22 22:22:41 -03:00 |
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INFO
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modules/inductor-2p.fpd: footprints for 2-SMD inductors (3mmx3mm for now)
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2012-12-22 22:22:41 -03:00 |
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ir.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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ledsmd.fpd
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ledsmd.fpd: fixed polarized marker
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2012-06-18 18:01:17 +08:00 |
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lga.fpd
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modules/lga.fpd: LGA-16-3x3 package, for LIS3DH
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2012-12-22 18:50:44 -03:00 |
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Makefile
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modules/usb_a_rcpt_mid.fpd: Molex 48258-0002/0001, TE 1746311
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2014-01-05 12:09:57 -03:00 |
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mdip.fpd
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mdip.fpd: 1) set mil unit 2) added measurements 3) set width = 355 mil
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2012-05-23 17:28:22 +08:00 |
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meander-2450MHz.fpd
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modules/meander-2450MHz.fpd: make all pads "trace" (regression)
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2012-07-19 00:10:19 -03:00 |
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memcard8-amp-10100660.fpd
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modules/memcard8-amp-10100660.fpd: Amphenol 10100660 footprint (draft)
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2013-09-15 11:26:47 -03:00 |
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mic-ra-dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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mini-usb.fpd
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Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming)
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2011-08-14 03:06:15 -03:00 |
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pads-array.fpd
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modules/pads-array.fpd: added measurements; enabled more pads types
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2012-07-13 23:01:03 -03:00 |
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pads.fpd
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modules/: add PAD_S_120x120; correct classification of PAD_S_150x150
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2012-08-10 08:48:52 -03:00 |
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phonejack.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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qfn.fpd
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modules/qfn.fpd: add QFN48-Freescale for KL25 chips (draft)
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2013-09-14 23:16:22 -03:00 |
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qfp-gen.fpd
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modules/qfp-gen.fpd: further improvements (WIP)
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2012-05-29 21:52:30 -03:00 |
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qfp.fpd
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qfp.fpd: added QFP64 variant
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2012-06-04 16:46:19 +08:00 |
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rca-3-ra.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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rj45.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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soic.fpd
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added SOIC footprints: 8, 14 and 16 pins.
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2012-05-28 13:53:41 +08:00 |
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sot23.fpd
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sot23.fpd: added measurement for max. distance between pads.
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2012-06-06 11:05:40 +08:00 |
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sot-323.fpd
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Moved sot-323.fpd from ben-wpan to kicad-libs (incoming)
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2011-08-14 04:49:36 -03:00 |
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sot.fpd
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modules/sot.fpd: add 236 (23-6) footprint
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2013-09-15 21:42:04 -03:00 |
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spacer.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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ssop.fpd
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modules/ssop.fpd: add TSSOP-16
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2012-11-02 23:34:45 -03:00 |
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stdpass.fpd
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modules/stdpass.fpd: add 1008 (for Samsung CIG22L4R7MNE inductor)
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2013-09-15 21:22:23 -03:00 |
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sw-spdt-smt.fpd
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modules/sw-spdt-smt.fpd: draw complete outline of case
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2013-09-30 04:51:48 -03:00 |
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tactile-sw-spst-ra-dip.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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template.pro
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modules/: "make brd" opens pcbnew for footprint examination
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2012-12-20 22:42:55 -03:00 |
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to.fpd
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modules/to.fpd (TO-252): remove zero-width pad 2
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2012-07-12 04:36:51 -03:00 |
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tsop.fpd
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tsop.fpd: changed measurements and moved marker to be close to pin1's left side.
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2012-06-05 22:19:26 +08:00 |
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tssop5.fpd
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modules/tssop5.fpd: remove zero-width pad 5
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2012-07-12 04:38:38 -03:00 |
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tswa.fpd
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modules/tswa.fpd: add more measurements
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2013-09-20 20:30:33 -03:00 |
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usb_a_plug_smt.fpd
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modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare"
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2012-07-19 00:04:29 -03:00 |
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usb_a_rcpt_mid.fpd
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modules/usb_a_rcpt_mid.fpd: correct 48258 drill hole; make pin pads oval
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2014-01-05 15:30:48 -03:00 |
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usb_a_rcpt_smt.fpd
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modules/usb_a_rcpt_smt.fpd: USB A receptacle
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2013-10-25 20:45:38 -03:00 |
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usb-a-dual-recept-r.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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usb-a-pcb.fpd
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modules/usb-a-pcb.fpd: change pad type from "normal" to "bare"
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2012-07-18 23:41:26 -03:00 |
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xlr-plug.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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xlr-socket.fpd
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modules/: make pads of all fully through-hole components "bare"
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2012-07-19 00:02:05 -03:00 |
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xtal-2.fpd
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xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm
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2012-06-07 13:42:15 +08:00 |
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xtal-4.fpd
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xtal-4.fpd: added xtal4-5mmx3.2mm variant package
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2012-06-07 14:37:28 +08:00 |
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zx62-b-5pa.fpd
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modules/zx62-b-5pa.fpd: add ZX62R-B-5P (Micro-USB B reversed) footprint
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2013-09-25 13:17:57 -03:00 |
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zx62m-b-5p.fpd
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modules/zx62m-b-5p.fpd: add Y size of rear pads
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2012-08-03 20:24:32 -03:00 |
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