..
8_10-card.fpd
8_10-card.fpd: set pad type to "bare", so the we don't get solder paste on them
2011-01-17 22:14:25 -03:00
8_10-socket-ra.fpd
8_10-socket-ra.fpd: added 8:10-SOCKET-RA
2012-06-14 20:41:07 +08:00
bat-clip-aa-th.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
bga.fpd
bga.fpd: added module for Altera 484-FineLine BGA(FBGA) and Xilinx FG(G)484 Fine-Pitch BGA, 1.00 mm pitch
2012-06-05 14:27:02 +08:00
c-smd.fpd
c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors
2012-06-07 20:26:59 +08:00
c-t-smd.fpd
c-t-smd.fpd: added variants named: TC-$Case-$EIA-$Density for relevant EIA size of Tantalum capacitors
2012-06-08 13:28:55 +08:00
dcjack.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
DESCR
modules/{Makefile, DESCR}: include descriptions in catalog
2012-07-12 18:55:40 -03:00
din-5.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
dip4of6.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
dip.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
do-214.fpd
do-214.fpd: added DO-214AA package
2012-06-06 15:57:00 +08:00
dvi-recept-ra.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
eus.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
fiducial.fpd
modules/INFO, modules/Makefile, modules/fiducial.fpd, AUTHORS: added fiducial
2011-03-23 12:33:40 -03:00
he-2row-dip.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
he-shrouded.fpd
he-shrouded.fpd: added NPTH frame
2012-06-12 19:10:20 +08:00
header.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
HIERARCHY
modules/: add ZX62M-B-BP (zx62m-b-5p.fpd) to catalog and Makefile
2012-07-14 22:46:59 -03:00
INFO
modules/: add measurementes to DIP-4/6-300mil; add to catalog and Makefile
2012-07-14 22:37:19 -03:00
ir.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
ledsmd.fpd
ledsmd.fpd: fixed polarized marker
2012-06-18 18:01:17 +08:00
Makefile
modules/: add ZX62M-B-BP (zx62m-b-5p.fpd) to catalog and Makefile
2012-07-14 22:46:59 -03:00
mdip.fpd
mdip.fpd: 1) set mil unit 2) added measurements 3) set width = 355 mil
2012-05-23 17:28:22 +08:00
meander-2450MHz.fpd
modules/meander-2450MHz.fpd: make all pads "trace" (regression)
2012-07-19 00:10:19 -03:00
mic-ra-dip.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
mini-usb.fpd
Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming)
2011-08-14 03:06:15 -03:00
pads-array.fpd
modules/pads-array.fpd: added measurements; enabled more pads types
2012-07-13 23:01:03 -03:00
pads.fpd
modules/pads.fpd: make also square and rectangular pads "bare"
2012-07-19 00:03:32 -03:00
phonejack.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
qfn.fpd
modules/qfn.fpd: add experimental footprint for AD CP-16-5a* MQ_LFCSP_LQ
2012-06-10 11:56:26 -03:00
qfp-gen.fpd
modules/qfp-gen.fpd: further improvements (WIP)
2012-05-29 21:52:30 -03:00
qfp.fpd
qfp.fpd: added QFP64 variant
2012-06-04 16:46:19 +08:00
rca-3-ra.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
rj45.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
soic.fpd
added SOIC footprints: 8, 14 and 16 pins.
2012-05-28 13:53:41 +08:00
sot23.fpd
sot23.fpd: added measurement for max. distance between pads.
2012-06-06 11:05:40 +08:00
sot-323.fpd
Moved sot-323.fpd from ben-wpan to kicad-libs (incoming)
2011-08-14 04:49:36 -03:00
sot.fpd
modules/sot.fpd: put width measurement at constant distance from pad
2012-07-13 23:29:56 -03:00
spacer.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
ssop.fpd
ssop.fpd: added TSSOP14 variant and move marker placed at outside of left lower corner.
2012-06-04 15:51:29 +08:00
stdpass.fpd
stdpass.fpd: added 1812 size which referred from TycoElectronics
2012-06-08 15:49:53 +08:00
tactile-sw-spst-ra-dip.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
to.fpd
modules/to.fpd (TO-252): remove zero-width pad 2
2012-07-12 04:36:51 -03:00
tsop.fpd
tsop.fpd: changed measurements and moved marker to be close to pin1's left side.
2012-06-05 22:19:26 +08:00
tssop5.fpd
modules/tssop5.fpd: remove zero-width pad 5
2012-07-12 04:38:38 -03:00
usb_a_plug_smt.fpd
modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare"
2012-07-19 00:04:29 -03:00
usb-a-dual-recept-r.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
usb-a-pcb.fpd
modules/usb-a-pcb.fpd: change pad type from "normal" to "bare"
2012-07-18 23:41:26 -03:00
xlr-plug.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
xlr-socket.fpd
modules/: make pads of all fully through-hole components "bare"
2012-07-19 00:02:05 -03:00
xtal-2.fpd
xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm
2012-06-07 13:42:15 +08:00
xtal-4.fpd
xtal-4.fpd: added xtal4-5mmx3.2mm variant package
2012-06-07 14:37:28 +08:00
zx62m-b-5p.fpd
modules/zx62m-b-5p.fpd: Hirose ZX62M-B-5P Micro-USB receptacle (mid-mount)
2012-04-01 20:12:02 -03:00