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Code
c0e33e5872
kicad-libs/modules
History
Werner Almesberger c0e33e5872 modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare" 
Rationale: if soldering in the SMT process, one probably wants to check
the TH pads anyway, so there is little point in putting solder paste on
them with the hope that some may stick.

If soldering in a separate TH process, solder paste could clog the holes.
2012-07-19 00:04:29 -03:00
..
8_10-card.fpd 8_10-card.fpd: set pad type to "bare", so the we don't get solder paste on them 2011-01-17 22:14:25 -03:00
8_10-socket-ra.fpd 8_10-socket-ra.fpd: added 8:10-SOCKET-RA 2012-06-14 20:41:07 +08:00
bat-clip-aa-th.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
bga.fpd bga.fpd: added module for Altera 484-FineLine BGA(FBGA) and Xilinx FG(G)484 Fine-Pitch BGA, 1.00 mm pitch 2012-06-05 14:27:02 +08:00
c-smd.fpd c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors 2012-06-07 20:26:59 +08:00
c-t-smd.fpd c-t-smd.fpd: added variants named: TC-$Case-$EIA-$Density for relevant EIA size of Tantalum capacitors 2012-06-08 13:28:55 +08:00
dcjack.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
DESCR modules/{Makefile, DESCR}: include descriptions in catalog 2012-07-12 18:55:40 -03:00
din-5.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
dip4of6.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
do-214.fpd do-214.fpd: added DO-214AA package 2012-06-06 15:57:00 +08:00
dvi-recept-ra.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
eus.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
fiducial.fpd modules/INFO, modules/Makefile, modules/fiducial.fpd, AUTHORS: added fiducial 2011-03-23 12:33:40 -03:00
he-2row-dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
he-shrouded.fpd he-shrouded.fpd: added NPTH frame 2012-06-12 19:10:20 +08:00
header.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
HIERARCHY modules/: add ZX62M-B-BP (zx62m-b-5p.fpd) to catalog and Makefile 2012-07-14 22:46:59 -03:00
INFO modules/: add measurementes to DIP-4/6-300mil; add to catalog and Makefile 2012-07-14 22:37:19 -03:00
ir.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
ledsmd.fpd ledsmd.fpd: fixed polarized marker 2012-06-18 18:01:17 +08:00
Makefile modules/: add ZX62M-B-BP (zx62m-b-5p.fpd) to catalog and Makefile 2012-07-14 22:46:59 -03:00
mdip.fpd mdip.fpd: 1) set mil unit 2) added measurements 3) set width = 355 mil 2012-05-23 17:28:22 +08:00
meander-2450MHz.fpd modules/meander-2450MHz.fpd: do not try to add a tail if zero-sized 2012-07-12 16:16:01 -03:00
mic-ra-dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
mini-usb.fpd Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming) 2011-08-14 03:06:15 -03:00
pads-array.fpd modules/pads-array.fpd: added measurements; enabled more pads types 2012-07-13 23:01:03 -03:00
pads.fpd modules/pads.fpd: make also square and rectangular pads "bare" 2012-07-19 00:03:32 -03:00
phonejack.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
qfn.fpd modules/qfn.fpd: add experimental footprint for AD CP-16-5a* MQ_LFCSP_LQ 2012-06-10 11:56:26 -03:00
qfp-gen.fpd modules/qfp-gen.fpd: further improvements (WIP) 2012-05-29 21:52:30 -03:00
qfp.fpd qfp.fpd: added QFP64 variant 2012-06-04 16:46:19 +08:00
rca-3-ra.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
rj45.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
soic.fpd added SOIC footprints: 8, 14 and 16 pins. 2012-05-28 13:53:41 +08:00
sot23.fpd sot23.fpd: added measurement for max. distance between pads. 2012-06-06 11:05:40 +08:00
sot-323.fpd Moved sot-323.fpd from ben-wpan to kicad-libs (incoming) 2011-08-14 04:49:36 -03:00
sot.fpd modules/sot.fpd: put width measurement at constant distance from pad 2012-07-13 23:29:56 -03:00
spacer.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
ssop.fpd ssop.fpd: added TSSOP14 variant and move marker placed at outside of left lower corner. 2012-06-04 15:51:29 +08:00
stdpass.fpd stdpass.fpd: added 1812 size which referred from TycoElectronics 2012-06-08 15:49:53 +08:00
tactile-sw-spst-ra-dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
to.fpd modules/to.fpd (TO-252): remove zero-width pad 2 2012-07-12 04:36:51 -03:00
tsop.fpd tsop.fpd: changed measurements and moved marker to be close to pin1's left side. 2012-06-05 22:19:26 +08:00
tssop5.fpd modules/tssop5.fpd: remove zero-width pad 5 2012-07-12 04:38:38 -03:00
usb_a_plug_smt.fpd modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare" 2012-07-19 00:04:29 -03:00
usb-a-dual-recept-r.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
usb-a-pcb.fpd modules/usb-a-pcb.fpd: change pad type from "normal" to "bare" 2012-07-18 23:41:26 -03:00
xlr-plug.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
xlr-socket.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
xtal-2.fpd xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm 2012-06-07 13:42:15 +08:00
xtal-4.fpd xtal-4.fpd: added xtal4-5mmx3.2mm variant package 2012-06-07 14:37:28 +08:00
zx62m-b-5p.fpd modules/zx62m-b-5p.fpd: Hirose ZX62M-B-5P Micro-USB receptacle (mid-mount) 2012-04-01 20:12:02 -03:00