1
0
mirror of git://projects.qi-hardware.com/kicad-libs.git synced 2024-07-02 13:32:20 +03:00
kicad-libs/modules
2014-01-05 12:09:57 -03:00
..
8_10-card.fpd 8_10-card.fpd: set pad type to "bare", so the we don't get solder paste on them 2011-01-17 22:14:25 -03:00
8_10-socket-ra-push-pull.fpd modules/8_10-socket-ra-push-pull.fpd: Amphenol 114-00841-68 push-pull uSD 2012-12-22 22:01:06 -03:00
8_10-socket-ra.fpd 8_10-socket-ra.fpd: added 8:10-SOCKET-RA 2012-06-14 20:41:07 +08:00
bat-clip-aa-th.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
bga.fpd bga: use the nominal size 2012-12-21 22:32:53 +08:00
c-smd.fpd c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors 2012-06-07 20:26:59 +08:00
c-t-smd.fpd c-t-smd.fpd: added variants named: TC-$Case-$EIA-$Density for relevant EIA size of Tantalum capacitors 2012-06-08 13:28:55 +08:00
dcjack.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
DESCR modules/usb_a_rcpt_mid.fpd: Molex 48258-0002/0001, TE 1746311 2014-01-05 12:09:57 -03:00
dfn.fpd modules/dfn.fpd: DFN-8 (aka TI's WSON-8) package, for TPS6216x 2012-12-21 20:22:17 -03:00
din-5.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
dip4of6.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
do-214.fpd do-214.fpd: added DO-214AA package 2012-06-06 15:57:00 +08:00
dvi-recept-ra.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
e-switch320.fpd modules/: add E-SWITCH series 320 tact switch 2012-08-22 16:34:32 -03:00
er-oled-fpc30.fpd modules/er-oled-fpc30.fpd: make pads 0.06 mm wider, 0.1 mm longer 2013-09-20 15:01:29 -03:00
eus.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
evqq7.fpd add Panasonic EVQQ7 "joystick" switch 2012-11-05 17:47:12 -03:00
fiducial.fpd modules/INFO, modules/Makefile, modules/fiducial.fpd, AUTHORS: added fiducial 2011-03-23 12:33:40 -03:00
he-2row-dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
he-shrouded.fpd he-shrouded.fpd: added NPTH frame 2012-06-12 19:10:20 +08:00
header.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
HIERARCHY modules/usb_a_rcpt_mid.fpd: Molex 48258-0002/0001, TE 1746311 2014-01-05 12:09:57 -03:00
inductor-2p.fpd modules/inductor-2p.fpd: footprints for 2-SMD inductors (3mmx3mm for now) 2012-12-22 22:22:41 -03:00
INFO modules/inductor-2p.fpd: footprints for 2-SMD inductors (3mmx3mm for now) 2012-12-22 22:22:41 -03:00
ir.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
ledsmd.fpd ledsmd.fpd: fixed polarized marker 2012-06-18 18:01:17 +08:00
lga.fpd modules/lga.fpd: LGA-16-3x3 package, for LIS3DH 2012-12-22 18:50:44 -03:00
Makefile modules/usb_a_rcpt_mid.fpd: Molex 48258-0002/0001, TE 1746311 2014-01-05 12:09:57 -03:00
mdip.fpd mdip.fpd: 1) set mil unit 2) added measurements 3) set width = 355 mil 2012-05-23 17:28:22 +08:00
meander-2450MHz.fpd modules/meander-2450MHz.fpd: make all pads "trace" (regression) 2012-07-19 00:10:19 -03:00
memcard8-amp-10100660.fpd modules/memcard8-amp-10100660.fpd: Amphenol 10100660 footprint (draft) 2013-09-15 11:26:47 -03:00
mic-ra-dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
mini-usb.fpd Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming) 2011-08-14 03:06:15 -03:00
pads-array.fpd modules/pads-array.fpd: added measurements; enabled more pads types 2012-07-13 23:01:03 -03:00
pads.fpd modules/: add PAD_S_120x120; correct classification of PAD_S_150x150 2012-08-10 08:48:52 -03:00
phonejack.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
qfn.fpd modules/qfn.fpd: add QFN48-Freescale for KL25 chips (draft) 2013-09-14 23:16:22 -03:00
qfp-gen.fpd modules/qfp-gen.fpd: further improvements (WIP) 2012-05-29 21:52:30 -03:00
qfp.fpd qfp.fpd: added QFP64 variant 2012-06-04 16:46:19 +08:00
rca-3-ra.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
rj45.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
soic.fpd added SOIC footprints: 8, 14 and 16 pins. 2012-05-28 13:53:41 +08:00
sot-323.fpd Moved sot-323.fpd from ben-wpan to kicad-libs (incoming) 2011-08-14 04:49:36 -03:00
sot.fpd modules/sot.fpd: add 236 (23-6) footprint 2013-09-15 21:42:04 -03:00
sot23.fpd sot23.fpd: added measurement for max. distance between pads. 2012-06-06 11:05:40 +08:00
spacer.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
ssop.fpd modules/ssop.fpd: add TSSOP-16 2012-11-02 23:34:45 -03:00
stdpass.fpd modules/stdpass.fpd: add 1008 (for Samsung CIG22L4R7MNE inductor) 2013-09-15 21:22:23 -03:00
sw-spdt-smt.fpd modules/sw-spdt-smt.fpd: draw complete outline of case 2013-09-30 04:51:48 -03:00
tactile-sw-spst-ra-dip.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
template.pro modules/: "make brd" opens pcbnew for footprint examination 2012-12-20 22:42:55 -03:00
to.fpd modules/to.fpd (TO-252): remove zero-width pad 2 2012-07-12 04:36:51 -03:00
tsop.fpd tsop.fpd: changed measurements and moved marker to be close to pin1's left side. 2012-06-05 22:19:26 +08:00
tssop5.fpd modules/tssop5.fpd: remove zero-width pad 5 2012-07-12 04:38:38 -03:00
tswa.fpd modules/tswa.fpd: add more measurements 2013-09-20 20:30:33 -03:00
usb_a_plug_smt.fpd modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare" 2012-07-19 00:04:29 -03:00
usb_a_rcpt_mid.fpd modules/usb_a_rcpt_mid.fpd: Molex 48258-0002/0001, TE 1746311 2014-01-05 12:09:57 -03:00
usb_a_rcpt_smt.fpd modules/usb_a_rcpt_smt.fpd: USB A receptacle 2013-10-25 20:45:38 -03:00
usb-a-dual-recept-r.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
usb-a-pcb.fpd modules/usb-a-pcb.fpd: change pad type from "normal" to "bare" 2012-07-18 23:41:26 -03:00
xlr-plug.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
xlr-socket.fpd modules/: make pads of all fully through-hole components "bare" 2012-07-19 00:02:05 -03:00
xtal-2.fpd xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm 2012-06-07 13:42:15 +08:00
xtal-4.fpd xtal-4.fpd: added xtal4-5mmx3.2mm variant package 2012-06-07 14:37:28 +08:00
zx62-b-5pa.fpd modules/zx62-b-5pa.fpd: add ZX62R-B-5P (Micro-USB B reversed) footprint 2013-09-25 13:17:57 -03:00
zx62m-b-5p.fpd modules/zx62m-b-5p.fpd: add Y size of rear pads 2012-08-03 20:24:32 -03:00