kicad-libs

8_10-card.fpd

8_10-card.fpd: set pad type to "bare", so the we don't get solder paste on them

2011-01-17 22:14:25 -03:00

8_10-socket-ra.fpd

8_10-socket-ra.fpd: added 8:10-SOCKET-RA

2012-06-14 20:41:07 +08:00

bat-clip-aa-th.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

bga.fpd

bga.fpd: added module for Altera 484-FineLine BGA(FBGA) and Xilinx FG(G)484 Fine-Pitch BGA, 1.00 mm pitch

2012-06-05 14:27:02 +08:00

c-smd.fpd

c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors

2012-06-07 20:26:59 +08:00

c-t-smd.fpd

c-t-smd.fpd: added variants named: TC-$Case-$EIA-$Density for relevant EIA size of Tantalum capacitors

2012-06-08 13:28:55 +08:00

dcjack.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

DESCR

modules/{Makefile, DESCR}: include descriptions in catalog

2012-07-12 18:55:40 -03:00

din-5.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

dip4of6.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

dip.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

do-214.fpd

do-214.fpd: added DO-214AA package

2012-06-06 15:57:00 +08:00

dvi-recept-ra.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

eus.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

fiducial.fpd

modules/INFO, modules/Makefile, modules/fiducial.fpd, AUTHORS: added fiducial

2011-03-23 12:33:40 -03:00

he-2row-dip.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

he-shrouded.fpd

he-shrouded.fpd: added NPTH frame

2012-06-12 19:10:20 +08:00

header.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

HIERARCHY

modules/: add PAD_S_120x120; correct classification of PAD_S_150x150

2012-08-10 08:48:52 -03:00

INFO

modules/INFO: add resources for ZX62-B-5PA and ZX62M-B-5P

2012-08-03 20:29:52 -03:00

ir.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

ledsmd.fpd

ledsmd.fpd: fixed polarized marker

2012-06-18 18:01:17 +08:00

Makefile

modules/zx62-b-5pa.fpd: Hirose ZX62-B-5PA micro-USB B receptacle, std, no posts

2012-08-03 20:28:58 -03:00

mdip.fpd

mdip.fpd: 1) set mil unit 2) added measurements 3) set width = 355 mil

2012-05-23 17:28:22 +08:00

meander-2450MHz.fpd

modules/meander-2450MHz.fpd: make all pads "trace" (regression)

2012-07-19 00:10:19 -03:00

mic-ra-dip.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

mini-usb.fpd

Moved mini-usb.fpd and usb_a_plug_smt.fpd from ben-wpan to kicad-libs (incoming)

2011-08-14 03:06:15 -03:00

pads-array.fpd

modules/pads-array.fpd: added measurements; enabled more pads types

2012-07-13 23:01:03 -03:00

pads.fpd

modules/: add PAD_S_120x120; correct classification of PAD_S_150x150

2012-08-10 08:48:52 -03:00

phonejack.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

qfn.fpd

modules/qfn.fpd: add experimental footprint for AD CP-16-5a* MQ_LFCSP_LQ

2012-06-10 11:56:26 -03:00

qfp-gen.fpd

modules/qfp-gen.fpd: further improvements (WIP)

2012-05-29 21:52:30 -03:00

qfp.fpd

qfp.fpd: added QFP64 variant

2012-06-04 16:46:19 +08:00

rca-3-ra.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

rj45.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

soic.fpd

added SOIC footprints: 8, 14 and 16 pins.

2012-05-28 13:53:41 +08:00

sot23.fpd

sot23.fpd: added measurement for max. distance between pads.

2012-06-06 11:05:40 +08:00

sot-323.fpd

Moved sot-323.fpd from ben-wpan to kicad-libs (incoming)

2011-08-14 04:49:36 -03:00

sot.fpd

modules/sot.fpd: put width measurement at constant distance from pad

2012-07-13 23:29:56 -03:00

spacer.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

ssop.fpd

ssop.fpd: added TSSOP14 variant and move marker placed at outside of left lower corner.

2012-06-04 15:51:29 +08:00

stdpass.fpd

stdpass.fpd: added 1812 size which referred from TycoElectronics

2012-06-08 15:49:53 +08:00

tactile-sw-spst-ra-dip.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

to.fpd

modules/to.fpd (TO-252): remove zero-width pad 2

2012-07-12 04:36:51 -03:00

tsop.fpd

tsop.fpd: changed measurements and moved marker to be close to pin1's left side.

2012-06-05 22:19:26 +08:00

tssop5.fpd

modules/tssop5.fpd: remove zero-width pad 5

2012-07-12 04:38:38 -03:00

usb_a_plug_smt.fpd

modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare"

2012-07-19 00:04:29 -03:00

usb-a-dual-recept-r.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

usb-a-pcb.fpd

modules/usb-a-pcb.fpd: change pad type from "normal" to "bare"

2012-07-18 23:41:26 -03:00

xlr-plug.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

xlr-socket.fpd

modules/: make pads of all fully through-hole components "bare"

2012-07-19 00:02:05 -03:00

xtal-2.fpd

xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm

2012-06-07 13:42:15 +08:00

xtal-4.fpd

xtal-4.fpd: added xtal4-5mmx3.2mm variant package

2012-06-07 14:37:28 +08:00

zx62-b-5pa.fpd

modules/zx62-b-5pa.fpd: Hirose ZX62-B-5PA micro-USB B receptacle, std, no posts

2012-08-03 20:28:58 -03:00

zx62m-b-5p.fpd

modules/zx62m-b-5p.fpd: add Y size of rear pads

2012-08-03 20:24:32 -03:00