Note that QFN28-Atmel and QFN28-SiLabs still need verifying.
QFN28-SiLabs is quite differnt from NXP's specification.
- modules/INFO: added description of solder paste deposit dimensioning
rules (based on NXP's AN10365)
- modules/qfn.fpd (QFN32-VHHD-2, QFN32-VHHD-6): increased solder paste
deposits according to the rules
- Makefile (overview): run prettygerbv to generate an overview image
- Makefile (uoverview): copy the overview image to
downloads.qi-hardware.com and version it
- Makefile (clean): remove overview.png
- atben/Makefile (gerbv), atusb/Makefile (gerbv): show also the back
solder mask layer
- atben/README-PCB, atusb/README-PCB: don't claim the back solder mask
is empty
- atben/Makefile, atusb/Makefile (SCH, BRD): abstract path to .sch and
.brd via variables
- atben/Makefile, atusb/Makefile (gerber, fab): pass absolute path to
board file to pcbnew
- atben/Makefile, atusb/Makefile (gerber): put all options before the
file name argument
- atusb.brd: enabled Drawings layer
- atusb.brd: moved board dimensions to Drawings layer
- Makefile (clean): added $(NAME)-Drawings.gbr
- Makefile (GMERGE, gerber): use "gmerge" to merge Comments (which now
only contains the component references) into SilkS_Front
- Makefile (gerbv): Comments is now redundant; removed it
- Makefile (GMERGE, gerber): use "gmerge" to merge Comments (which now
only contains the component references) into SilkS_Front
- Makefile (gerbv): Comments is now redundant; removed it
- Makefile (MLZTX, mlztx): fails to update fields that exist but have
older content; removed
- Makefile (CPTX, cptx): use more robust but less elegant cptx process
for now
- Makefile (VERSION): bumped version from 110314 to 110314
- atusb.brd: bumped version on copper and re-generated version on silk
screen
- atusb.brd: bumped version in board meta-data
- Makefile (VERSION): bumped version from 110219 to 110314
- atben.brd: bumped version on copper and silk screen
- atben.brd: bumped version in board meta-data
- README-PCB: added imperial units for board thickness
- README-PCB: changed surface finish recommendation to prefer ENIG more
strongly
- README-PCB: removed instructions for Gerber file generation from
"interpretation of files section"
- README-PCB: mention common coordinate system origin
- atusb/Makefile (gerber, fab): use pcbnew with --origin=aux for Gerber,
drill, and DXF
- atusb/atusb.brd: set auxiliary origin to lower left corner of board
- Makefile (cptx): new target to update the version number on the silk
screen
- atusb.brd: duplicated the version number from the back copper on the
front silk screen
- atusb.brd: moved author tag to make room for front version number
- atben/Makefile (gerber, fab): use pcbnew with --origin=aux for Gerber,
drill, and DXF
- atben/atben.brd: set auxiliary origin to lower left corner of board
- atben.brd (B1), atusb.brd (B1): marked pin 1 location with a circle
- atusb.brd (D1): marked anode with a plus sign and moved the component
reference
- atben/Makefile (fab), atusb/Makefile (fab): changed name of PCB fab
archives from $(NAME)-$(VERSION)... to $(NAME)-pcb-$(VERSION)...
- atben/Makefile (upload), atusb/Makefile (upload): new target to
upload PCB fab archives to
http://downloads.qi-hardware.com/people/werner/wpan/fab/
- Makefile (VERSION, DIR): added board version and parent directory name
- Makefile: added generation of Gerbers and other fab files
- Makefile (gen): this never worked, changed --plot to --plot=ps
- Makefile: added section titles
- README-PCB: PCB making instructions
- Makefile (fab): / was missing between $(DIR) and $(NAME) of ZIP archive
- Makefile: added section titles
- Makefile: removed comment that --exclude-board-edges was missing
- Makefile (gerber): changed atben.brd to $(NAME).brd
- usb/usb.h, usb/atu2.c (usb_reset): reset the USB bus by detaching and
re-attaching the device
- boot.c (main): force a USB reset before running the payload
- usb/atu2.c (usb_poll): test for USB reset from the host (in progress)
- usb/dfu.c (my_reset, dfu_init): register user USB reset handler
- dfu.h (flash_end_write), flash.c (flash_end_write): write any incomplete
buffer
- flash.c (flash_write, flash_end_write): call boot_rww_enable only at the
very end, it won't erase our buffer in mid-page
- usb/dfu.c (my_setup): call flash_end_write at the end of a download
- flash.c (flash_write): we don't use eeprom_busy_wait, removed it
- flash.c (flash_write): write the page only at one place
- flash.c (flash_write): corrected the address of the page write
- flash.c (flash_write): value being added to word wasn't shifted
- Makefile (BOOT_ADDR, boot.elf): use variable instead of hiding the
address in a command
- Makefile (CFLAGS): pass BOOT_ADDR as a macro
- Makefile: removed commented-out application flashing code
- Makefile (VERSION): version for fab files
- Makefile (DIR): name of parent directory
- Makefile (fab) generate tar and zip files with files needed for PCB
production
- Makefile (clean): remove also $(NAME)-PCB_Edges.dxf
