- atben/README-SMT, atusb/README-SMT: description for SMT fab files
- bom/Makefile (%-smt.csv, spotless): renamed *-smt.csv to *-bom.csv
- makefiles/Makefile.kicad (fab): split into "fab" (PCB and SMT) and
fab-pcb (previous "fab"; only PCB)
- makefiles/Makefile.kicad (fab-smt): added packaging process for SMT
fab files
- Makefile (overview): run prettygerbv to generate an overview image
- Makefile (uoverview): copy the overview image to
downloads.qi-hardware.com and version it
- Makefile (clean): remove overview.png
- atben/Makefile (gerbv), atusb/Makefile (gerbv): show also the back
solder mask layer
- atben/README-PCB, atusb/README-PCB: don't claim the back solder mask
is empty
- atben/Makefile, atusb/Makefile (SCH, BRD): abstract path to .sch and
.brd via variables
- atben/Makefile, atusb/Makefile (gerber, fab): pass absolute path to
board file to pcbnew
- atben/Makefile, atusb/Makefile (gerber): put all options before the
file name argument
- Makefile (GMERGE, gerber): use "gmerge" to merge Comments (which now
only contains the component references) into SilkS_Front
- Makefile (gerbv): Comments is now redundant; removed it
- Makefile (MLZTX, mlztx): fails to update fields that exist but have
older content; removed
- Makefile (CPTX, cptx): use more robust but less elegant cptx process
for now
- Makefile (VERSION): bumped version from 110219 to 110314
- atben.brd: bumped version on copper and silk screen
- atben.brd: bumped version in board meta-data
- README-PCB: added imperial units for board thickness
- README-PCB: changed surface finish recommendation to prefer ENIG more
strongly
- README-PCB: removed instructions for Gerber file generation from
"interpretation of files section"
- README-PCB: mention common coordinate system origin
- atben/Makefile (gerber, fab): use pcbnew with --origin=aux for Gerber,
drill, and DXF
- atben/atben.brd: set auxiliary origin to lower left corner of board
- atben.brd (B1), atusb.brd (B1): marked pin 1 location with a circle
- atusb.brd (D1): marked anode with a plus sign and moved the component
reference
- atben/Makefile (fab), atusb/Makefile (fab): changed name of PCB fab
archives from $(NAME)-$(VERSION)... to $(NAME)-pcb-$(VERSION)...
- atben/Makefile (upload), atusb/Makefile (upload): new target to
upload PCB fab archives to
http://downloads.qi-hardware.com/people/werner/wpan/fab/
- Makefile (fab): / was missing between $(DIR) and $(NAME) of ZIP archive
- Makefile: added section titles
- Makefile: removed comment that --exclude-board-edges was missing
- Makefile (gerber): changed atben.brd to $(NAME).brd
- Makefile (VERSION): version for fab files
- Makefile (DIR): name of parent directory
- Makefile (fab) generate tar and zip files with files needed for PCB
production
- Makefile (clean): remove also $(NAME)-PCB_Edges.dxf
- atben/cam/mkmk: introduced variables for board corner
- atben/cam/mkmk: updated for new raw board
- atusb-pgm/cam/Makefile: updated for new board
- atusb/cam/Makefile: introduced abstraction with $(NAME)
- atusb/cam/Makefile: use cameo/templates/mkmk-simple instead of local mkmk
- atusb/cam/mkmk: removed
- atusb/cam/Makefile: updated for new board
- atben.brd (C4, C6, P1): moved component references for proper
visualization
- atben.brd: deleted leftover comment line
- atben.brd: version is now 20110219
- atben.brd: made ground zones go all the way around the board corner
- atben.brd: added one more via to crystal ground
- atben.brd: don't let crystal ground zone crawl under chip corner
- atben.brd: don't let RF ground zone crawl under chip corner
- atben.sch, atben.cmp, atben.brd: CLKM test point would have been
inaccessible - reduced its size and moved it closer to the transceiver
- atben.brd: made board 0.2 mm longer to create room to disentangle
analog power and crystal
- atben.brd: moved upper left VDD via to allow chamfered corner to be
larger
- atben.brd: moved DVDD via further away from the board edge
- atben.brd: straightened AVDD trace
- atben.pro: commit noise
- atben.brd: increased separation between VDD and SLP_TR via in upper left
corner
- atben.brd: rearranged ground zone around above vias
- atben.brd: separated ground zones for RF and analog power
- atben.brd: made antenna ground wrap around contact
- atben.sch: removed C9 (only exists in Jonhanson's reference design;
neither Atmel not Wuerth have it; in experiments, no effect was
observed)
- atben.brd: rotated the transceiver by 90 degrees and redid layout
- atben.brd: aligned 8:10 card shape and antenna to metric (0.1 mm) grid
and adjusted outline accordingly
- atben.sch, atben.brd: version is now 20110215
- atben.brd: make traces inside 8:10 card slot go straight as long as
possible, to avoid shorts with exposed contacts
- atben.brd: removed "IEEE 802.15.4" and "CC-BY-SA" from copper layer
- atben.brd: reduced date code to two-digit year
- atben.brd: bumped version to 20110207
- atben.brd: updated 0805-6 footprint of the balun and rearranged its
surroundings accordingly
- atben.brd: rearranged boundary between RF and power ground zones
- atben.brd: moved vias "south" of the balun by 5 mil
- atben.brd: moved component references C10, C11, and X1 such that
they're not convered by comment lines
- atben.brd: broke up comment line "east" of X1 to avoid overlap with C10
and C11 pads
- atben.brd: shifted author's name to make crossing lines coincide with
vertical strokes in letters
Settings according to
http://www.nxp.com/documents/mounting_and_soldering/AN10365.pdf
- atben.pro, atben.brd, atusb.pro, atusb.brd: set solder mask clearance
to 50 um (copper-defined pads)
- atben.pro, atben.brd, atusb.pro, atusb.brd: set solder paste clearance
to 25 um
- atben.brd: moved component references for proper printing on silk screen
- atben.brd: moved component values for easy display (do not print on
silk screen !)
- atben.brd: removed unused back silk screen and back solder paste layer
